Continuous analyte sensors and methods of making same

ABSTRACT

Described here are embodiments of processes and systems for the continuous manufacturing of implantable continuous analyte sensors. In some embodiments, a method is provided for sequentially advancing an elongated conductive body through a plurality of stations, each configured to treat the elongated conductive body. In some of these embodiments, one or more of the stations is configured to coat the elongated conductive body using a meniscus coating process, whereby a solution formed of a polymer and a solvent is prepared, the solution is continuously circulated to provide a meniscus on a top portion of a vessel holding the solution, and the elongated conductive body is advanced through the meniscus. The method may also comprise the step of removing excess coating material from the elongated conductive body by advancing the elongated conductive body through a die orifice. For example, a provided elongated conductive body  510  is advanced through a pre-coating treatment station  520 , through a coating station  530 , through a thickness control station  540 , through a drying or curing station  550 , through a thickness measurement station  560 , and through a post-coating treatment station  570.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. §119(e)to U.S. Provisional Application No. 61/222,716 filed on Jul. 2, 2009,U.S. Provisional Application No. 61/222,815 filed on Jul. 2, 2009, andU.S. Provisional Application No. 61/222,751 filed on Jul. 2, 2009, thedisclosures of which are hereby expressly incorporated by reference intheir entireties and are hereby expressly made a portion of thisapplication.

FIELD OF THE INVENTION

The embodiments described herein relate generally to continuous analytesensors and systems and methods for making these sensors.

BACKGROUND OF THE INVENTION

Diabetes mellitus is a chronic disease, which occurs when the pancreasdoes not produce enough insulin (Type I), or when the body cannoteffectively use the insulin it produces (Type II). This conditiontypically leads to an increased concentration of glucose in the blood(hyperglycemia), which can cause an array of physiological derangements(e.g., kidney failure, skin ulcers, or bleeding into the vitreous of theeye) associated with the deterioration of small blood vessels.Sometimes, a hypoglycemic reaction (low blood sugar) is induced by aninadvertent overdose of insulin, or after a normal dose of insulin orglucose-lowering agent accompanied by extraordinary exercise orinsufficient food intake.

A variety of implantable continuous electrochemical analyte sensors havebeen developed for continuously measuring blood glucose concentrations.Typically, these types of sensors have been made by batch processes,which may not be suitable for large-scale, low-cost manufacturing, andwhich often result in batch-to-batch variations, thereby resulting inproperty variations among the sensors produced.

SUMMARY OF THE INVENTION

Accordingly, there is a need for a process and system that will reduceproduction costs through labor reduction and minimize variations amongthe sensors produced, by providing automated, continuous manufacturingof continuous analyte sensors.

In a first aspect, a method is provided for manufacturing a continuousanalyte sensor, the method comprising applying an insulating material toan elongated conductive body comprising a conductive surface byadvancing the elongated conductive body through a meniscus comprisingthe insulating material; and drying or curing the applied insulatingmaterial to form a coating of the insulating material on the elongatedconductive body, the coating comprising a portion of the continuousanalyte sensor, whereby a continuous analyte sensor configured for invivo use is obtained.

In an embodiment of the first aspect, the method further comprisescontinuously circulating a liquid comprising the insulating material ina vessel, whereby the meniscus is provided at a wall of the vessel.

In an embodiment of the first aspect, the method further comprisesremoving a fraction of the insulating material applied to the elongatedconductive body.

In an embodiment of the first aspect, removing is performed by advancingthe elongated conductive body through a die.

In an embodiment of the first aspect, the method further comprisesdetermining whether a thickness of the coating is within a predeterminedrange; and repeating applying the insulating material to the elongatedconductive body if the thickness of the coating is outside of thepredetermined range.

In an embodiment of the first aspect, the predetermined range of thethickness of the coating is from about 5 microns to about 50 microns.

In an embodiment of the first aspect, the method further comprisesapplying an adhesion promoter to the elongated conductive body beforeapplying the insulating material.

In an embodiment of the first aspect, the method further comprisesetching a portion of the coating.

In an embodiment of the first aspect, the method further comprisescutting the elongated conductive body into a plurality of sections.

In an embodiment of the first aspect, each section is associated with anindividual continuous analyte sensor.

In an embodiment of the first aspect, the insulating material isselected from the group consisting of polyurethane, polyethylene, andpolyimide.

In an embodiment of the first aspect, the elongated conductive body is awire with a circular cross-sectional shape or a substantially circularcross-sectional shape.

In an embodiment of the first aspect, the conductive surface of theelongated conductive body comprises platinum.

In an embodiment of the first aspect, the conductive surface of theelongated conductive body comprises at least one conductive materialselected from the group consisting of platinum-iridium, gold, palladium,iridium, graphite, carbon, conductive polymers, and combinationsthereof.

In an embodiment of the first aspect, advancing the elongated conductivebody through the meniscus is performed by a reel-to-reel system.

In a second aspect, a method is provided for manufacturing a continuousanalyte sensor, the method comprising applying a conductive material toan elongated conductive body by advancing the elongated conductive bodythrough a liquid comprising the conductive material; drying or curingthe applied liquid to form a coating of the conductive material on theelongated conductive body, the coating comprising a portion of thecontinuous analyte sensor; determining whether a thickness of thecoating is within a predetermined range; and, if the thickness is belowthe predetermined range, repeating steps of applying a conductivematerial and drying or curing the applied liquid until the thickness ofthe coating is determined to be within the predetermined range, wherebya continuous analyte sensor configured for in vivo use is obtained.

In an embodiment of the second aspect, the method further comprisesremoving a fraction of the conductive material applied to the elongatedconductive body.

In an embodiment of the second aspect, removing is performed byadvancing the elongated conductive body through a die.

In an embodiment of the second aspect, the conductive material isAg/AgCl.

In an embodiment of the second aspect, the predetermined range of thethickness of the coating is from about 1 micron to about 20 microns.

In an embodiment of the second aspect, the conductive material isplatinum.

In an embodiment of the second aspect, the predetermined range is fromabout 1 micron to about 10 microns.

In an embodiment of the second aspect, the method further comprisesapplying an adhesion promoter to the elongated conductive body beforeapplying the conductive material.

In an embodiment of the second aspect, the method further comprisesetching a portion of the coating.

In an embodiment of the second aspect, the method further comprisescutting the elongated conductive body into a plurality of sections.

In an embodiment of the second aspect, each section is associated withan individual continuous analyte sensor.

In an embodiment of the second aspect, the conductive material isAg/AgCl.

In an embodiment of the second aspect, the conductive material has aparticle size associated with a maximum particle dimension that is lessthan about 100 microns.

In an embodiment of the second aspect, the elongated conductive body isa wire with a circular cross-sectional shape or a substantially circularcross-sectional shape.

In an embodiment of the second aspect, the elongated conductive bodycomprises an outer surface comprising an insulating material selectedfrom the group consisting of polyurethane, polyethylene, and polyimide.

In an embodiment of the second aspect, applying a conductive material isperformed by a reel-to-reel system.

In a third aspect, a system is provided for manufacturing a continuousanalyte sensor, the system comprising a coating vessel configured tohold a coating material in liquid form; a reel-to-reel system configuredto advance an elongated conductive body through the coating material,whereby the coating material is applied to the elongated conductivebody; a thickness measurement sensor configured to measure a dimensionindicative of a thickness of a coating formed from the coating materialapplied to the elongated conductive body; an etching system configuredto remove a portion of the coating material applied to the elongatedconductive body; and a cutter configured to cut the elongated conductivebody into a plurality of sections, wherein each section is associatedwith an individual continuous analyte sensor.

In an embodiment of the third aspect, the system further comprises a dieconfigured to remove a portion of the coating material applied to theelongated conductive body.

In an embodiment of the third aspect, the elongated conductive body is awire with a circular cross-sectional shape or a substantially circularcross-sectional shape.

In an embodiment of the third aspect, the coating material comprises aninsulating material selected from the group consisting of polyurethane,polyethylene, and polyimide.

In an embodiment of the third aspect, the coating material comprises aconductive material selected from the group consisting of platinum,silver/silver chloride, platinum-iridium, gold, palladium, iridium,graphite, carbon, conductive polymers, and alloys and combinationsthereof.

In an embodiment of the third aspect, the system further comprises apump and conduit system configured to circulate the coating material inliquid form in the coating vessel to provide a meniscus at a wall of thecoating vessel.

In an embodiment of the third aspect, coating material is a component ofa solution, wherein the solution is controlled to have a predeterminedviscosity.

In an embodiment of the third aspect, the viscosity is controlled byselecting a concentration of the coating material in the solution or byselecting a solution temperature.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of one embodiment of an automated,continuous system for manufacturing continuous analyte sensors; FIG. 1Bis a schematic diagram of another embodiment of an automated, continuoussystem for manufacturing continuous analyte sensors; FIG. 1C is aschematic diagram of yet another embodiment of an automated, continuoussystem for manufacturing continuous analyte sensors; FIG. 1D is aschematic diagram of yet another embodiment of an automated, continuoussystem for manufacturing continuous analyte sensors; FIG. 1E is aschematic diagram of yet another embodiment of an automated, continuoussystem for manufacturing continuous analyte sensors.

FIG. 2A is a side view of one embodiment of a transport mechanism; FIG.2B is a front view of the embodiment illustrated in FIG. 2A.

FIG. 3A is a schematic diagram of one embodiment of a coating station;FIG. 3B is a schematic diagram providing a detailed view of theinterface between the elongated conductive body and the meniscus, of theembodiment illustrated in FIG. 3A; FIG. 3C is a schematic diagram ofanother embodiment of a coating station; FIG. 3D is a schematic diagramof yet another embodiment of a coating station; FIG. 3E is a schematicdiagram of yet another embodiment of a coating station; FIG. 3F is aschematic diagram of yet another embodiment of a coating station; FIG.3G is a schematic diagram of an embodiment of a coating stationcomprising a coating vessel with a die; FIG. 3H is a close side view ofthe die illustrated in FIG. 3G; FIG. 3I provides a view of the coatingchamber illustrated FIG. 3G on lines 3I-3I; FIG. 3J illustrates variousexamples of cross-sectional shapes of a die orifice; FIG. 3K is aschematic diagram of yet another embodiment of a coating station.

FIG. 4A is side view of an elongated conductive body having portionsthat are covered by one or more layers of material and portions that areuncovered; FIG. 4B is a side view of the elongated conductive body ofFIG. 4A after it has been coated with a layer of coating material.

FIG. 5 is a flowchart summarizing the steps of one embodiment of amethod for continuously manufacturing analyte sensors.

FIGS. 6A and 6B are cross-sectional views through one embodiment of theelongated conductive body of FIG. 4B on lines 6A-6A and 6B-6B,respectively.

FIG. 7A illustrates one embodiment of an elongated conductive body; FIG.7B illustrates the embodiment of FIG. 7A after it has undergone laserablation treatment; FIG. 7C illustrates another embodiment of anelongated conductive body; FIG. 7D illustrates the embodiment of FIG. 7Cafter it has undergone laser ablation treatment.

FIG. 8A illustrates one embodiment of an elongated conductive body; FIG.8B illustrates the embodiment of FIG. 8A after it has undergone laserablation treatment; FIG. 8C illustrates another embodiment of anelongated conductive body; FIG. 8D illustrates the embodiment of FIG. 8Cafter it has undergone laser ablation treatment.

FIG. 9A illustrates a recessed region formed with a curved edge; FIG. 9Billustrates a recessed region formed with a sharp edge.

FIG. 10A illustrates one embodiment of a die; FIG. 10B provides a viewof the die on lines 10B-10B of FIG. 10A.

FIG. 11 illustrates one embodiment of a system that integrates etchingand singulation of the elongated conductive body.

It should be understood that the figures shown herein are notnecessarily drawn to scale.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description and examples describe in detail some exemplaryembodiments of systems and methods for manufacturing continuous analytesensors. It should be understood that there are numerous variations andmodifications of the systems, methods, and devices described herein thatare encompassed by the present invention. Accordingly, the descriptionof a certain exemplary embodiment should not be deemed to limit thescope of the present invention.

DEFINITIONS

In order to facilitate an understanding of the devices and methodsdescribed herein, a number of terms are defined below.

The term “analyte,” as used herein, is a broad term, and is to be givenits ordinary and customary meaning to a person of ordinary skill in theart (and is not to be limited to a special or customized meaning), andrefers without limitation to a substance or chemical constituent in abiological fluid (for example, blood, interstitial fluid, cerebralspinal fluid, lymph fluid, urine, sweat, saliva, etc.) that can beanalyzed. Analytes can include naturally occurring substances,artificial substances, metabolites, or reaction products. In someembodiments, the analyte for measurement by the sensing regions,devices, and methods is glucose. However, other analytes arecontemplated as well, including, but not limited to:acarboxyprothrombin; acylcarnitine; adenine phosphoribosyl transferase;adenosine deaminase; albumin; alpha-fetoprotein; amino acid profiles(arginine (Krebs cycle), histidine/urocanic acid, homocysteine,phenylalanine/tyrosine, tryptophan); andrenostenedione; antipyrine;arabinitol enantiomers; arginase; benzoylecgonine (cocaine);biotinidase; biopterin; c-reactive protein; carnitine; carnosinase; CD4;ceruloplasmin; chenodeoxycholic acid; chloroquine; cholesterol;cholinesterase; conjugated 1-β hydroxy-cholic acid; cortisol; creatinekinase; creatine kinase MM isoenzyme; cyclosporin A; d-penicillamine;de-ethylchloroquine; dehydroepiandrosterone sulfate; DNA (acetylatorpolymorphism, alcohol dehydrogenase, alpha 1-antitrypsin, cysticfibrosis, Duchenne/Becker muscular dystrophy, glucose-6-phosphatedehydrogenase, hemoglobin A, hemoglobin S, hemoglobin C, hemoglobin D,hemoglobin E, hemoglobin F, D-Punjab, beta-thalassemia, hepatitis Bvirus, HCMV, HIV-1, HTLV-1, Leber hereditary optic neuropathy, MCAD,RNA, PKU, Plasmodium vivax, sexual differentiation, 21-deoxycortisol);desbutylhalofantrine; dihydropteridine reductase; diptheria/tetanusantitoxin; erythrocyte arginase; erythrocyte protoporphyrin; esterase D;fatty acids/acylglycines; free β-human chorionic gonadotropin; freeerythrocyte porphyrin; free thyroxine (FT4); free tri-iodothyronine(FT3); fumarylacetoacetase; galactose/gal-1-phosphate;galactose-1-phosphate uridyltransferase; gentamicin; glucose-6-phosphatedehydrogenase; glutathione; glutathione perioxidase; glycocholic acid;glycosylated hemoglobin; halofantrine; hemoglobin variants;hexosaminidase A; human erythrocyte carbonic anhydrase I;17-alpha-hydroxyprogesterone; hypoxanthine phosphoribosyl transferase;immunoreactive trypsin; lactate; lead; lipoproteins ((a), B/A-1, β);lysozyme; mefloquine; netilmicin; phenobarbitone; phenyloin;phytanic/pristanic acid; progesterone; prolactin; prolidase; purinenucleoside phosphorylase; quinine; reverse tri-iodothyronine (rT3);selenium; serum pancreatic lipase; sissomicin; somatomedin C; specificantibodies (adenovirus, anti-nuclear antibody, anti-zeta antibody,arbovirus, Aujeszky's disease virus, dengue virus, Dracunculusmedinensis, Echinococcus granulosus, Entamoeba histolytica, enterovirus,Giardia duodenalisa, Helicobacter pylori, hepatitis B virus, herpesvirus, HIV-1, IgE (atopic disease), influenza virus, Leishmaniadonovani, leptospira, measles/mumps/rubella, Mycobacterium leprae,Mycoplasma pneumoniae, Myoglobin, Onchocerca volvulus, parainfluenzavirus, Plasmodium falciparum, poliovirus, Pseudomonas aeruginosa,respiratory syncytial virus, rickettsia (scrub typhus), Schistosomamansoni, Toxoplasma gondii, Trepenoma pallidium, Trypanosomacruzi/rangeli, vesicular stomatis virus, Wuchereria bancrofti, yellowfever virus); specific antigens (hepatitis B virus, HIV-1);succinylacetone; sulfadoxine; theophylline; thyrotropin (TSH); thyroxine(T4); thyroxine-binding globulin; trace elements; transferrin;UDP-galactose-4-epimerase; urea; uroporphyrinogen I synthase; vitamin A;white blood cells; and zinc protoporphyrin. Salts, sugar, protein, fat,vitamins, and hormones naturally occurring in blood or interstitialfluids can also constitute analytes in certain embodiments. The analytecan be naturally present in the biological fluid or endogenous, forexample, a metabolic product, a hormone, an antigen, an antibody, andthe like. Alternatively, the analyte can be introduced into the body orexogenous, for example, a contrast agent for imaging, a radioisotope, achemical agent, a fluorocarbon-based synthetic blood, or a drug orpharmaceutical composition, including but not limited to: insulin;ethanol; cannabis (marijuana, tetrahydrocannabinol, hashish); inhalants(nitrous oxide, amyl nitrite, butyl nitrite, chlorohydrocarbons,hydrocarbons); cocaine (crack cocaine); stimulants (amphetamines,methamphetamines, Ritalin, Cylert, Preludin, Didrex, PreState, Voranil,Sandrex, Plegine); depressants (barbituates, methaqualone, tranquilizerssuch as Valium, Librium, Miltown, Serax, Equanil, Tranxene);hallucinogens (phencyclidine, lysergic acid, mescaline, peyote,psilocybin); narcotics (heroin, codeine, morphine, opium, meperidine,Percocet, Percodan, Tussionex, Fentanyl, Darvon, Talwin, Lomotil);designer drugs (analogs of fentanyl, meperidine, amphetamines,methamphetamines, and phencyclidine, for example, Ecstasy); anabolicsteroids; and nicotine. The metabolic products of drugs andpharmaceutical compositions are also contemplated analytes. Analytessuch as neurochemicals and other chemicals generated within the body canalso be analyzed, such as, for example, ascorbic acid, uric acid,dopamine, noradrenaline, 3-methoxytyramine (3MT),3,4-dihydroxyphenylacetic acid (DOPAC), homovanillic acid (HVA),5-hydroxytryptamine (5HT), and 5-hydroxyindoleacetic acid (FHIAA).

The term “continuous,” as used herein in reference to analyte sensing,is a broad term, and is to be given its ordinary and customary meaningto a person of ordinary skill in the art (and is not to be limited to aspecial or customized meaning), and refers without limitation to thecontinuous, continual, or intermittent (e.g., regular) monitoring ofanalyte concentration, such as, for example, performing a measurementabout every 1 to 10 minutes.

The term “elongated conductive body,” as used herein is a broad term,and is to be given its ordinary and customary meaning to a person ofordinary skill in the art (and is not to be limited to a special orcustomized meaning), and refers without limitation to an elongated bodyformed at least in part of a conductive material and includes any numberof coatings that may be formed thereon. By way of example, an “elongatedconductive body” can mean a bare elongated core (e.g., a conductivemetal wire, a non-conductive polymer rod) or an elongated core coatedwith one, two, three, four, five, or more layers of material that may beor may not be conductive.

The terms “electrochemically reactive surface” and “electroactivesurface,” as used herein, are broad terms, and are to be given theirordinary and customary meaning to a person of ordinary skill in the art(and are not to be limited to a special or customized meaning), andrefer without limitation to the surface of an electrode where anelectrochemical reaction is to take place. As one example, in a workingelectrode, H₂O₂ (hydrogen peroxide) produced by an enzyme-catalyzedreaction of an analyte being detected reacts and thereby creates ameasurable electric current. For example, in the detection of glucose,glucose oxidase produces H₂O₂ as a byproduct. The H₂O₂ reacts with thesurface of the working electrode to produce two protons (2H⁺), twoelectrons (2e⁻) and one molecule of oxygen (O₂), which produces theelectric current being detected. In the case of the counter electrode, areducible species, for example, O₂ is reduced at the electrode surfacein order to balance the current being generated by the workingelectrode.

The term “sensing region,” as used herein, is a broad term, and is to begiven its ordinary and customary meaning to a person of ordinary skillin the art (and is not to be limited to a special or customizedmeaning), and refers without limitation to the region of a monitoringdevice responsible for the detection of a particular analyte.

The phrase “distal to,” as used herein, is a broad term, and is to begiven its ordinary and customary meaning to a person of ordinary skillin the art (and is not to be limited to a special or customizedmeaning), and refers without limitation to the spatial relationshipbetween various elements in comparison to a particular point ofreference. For example, some embodiments of a sensor include a membranesystem having a diffusion resistance layer and an enzyme layer. If thesensor is deemed to be the point of reference and the diffusionresistance layer is positioned farther from the sensor than the enzymelayer, then the diffusion resistance layer is more distal to the sensorthan the enzyme layer.

The phrase “proximal to,” as used herein, is a broad term, and is to begiven its ordinary and customary meaning to a person of ordinary skillin the art (and is not to be limited to a special or customizedmeaning), and refers without limitation to the spatial relationshipbetween various elements in comparison to a particular point ofreference. For example, some embodiments of a device include a membranesystem having a diffusion resistance layer and an enzyme layer. If thesensor is deemed to be the point of reference and the enzyme layer ispositioned nearer to the sensor than the diffusion resistance layer,then the enzyme layer is more proximal to the sensor than the diffusionresistance layer.

The term “interferents,” as used herein, is a broad term, and is to begiven its ordinary and customary meaning to a person of ordinary skillin the art (and is not to be limited to a special or customizedmeaning), and refers without limitation to effects or species thatinterfere with the measurement of an analyte of interest in a sensor toproduce a signal that does not accurately represent the analytemeasurement. In an exemplary electrochemical sensor, interferents caninclude compounds with an oxidation potential that overlaps with that ofthe analyte to be measured.

The terms “membrane system” and “membrane,” as used herein, are broadterms, and are to be given their ordinary and customary meaning to aperson of ordinary skill in the art (and are not to be limited to aspecial or customized meaning), and refer without limitation to apermeable or semi-permeable membrane that can comprise one or morelayers and constructed of materials, which are permeable to oxygen andmay or may not be permeable to an analyte of interest. In one example,the membrane system comprises an immobilized glucose oxidase enzyme,which enables an electrochemical reaction to occur to measure aconcentration of glucose.

The term “coefficient of variation,” as used herein, is a broad term,and is to be given its ordinary and customary meaning to a person ofordinary skill in the art (and is not to be limited to a special orcustomized meaning), and refers without limitation to the ratio of thestandard deviation of a distribution to its arithmetic mean. Thecoefficient of variation can be calculated by the equation: coefficientof variation=standard deviation/mean.

The term “sensitivity,” as used herein, is a broad term, and is to begiven its ordinary and customary meaning to a person of ordinary skillin the art (and is not to be limited to a special or customizedmeaning), and refers without limitation to an amount of electricalcurrent produced by a predetermined amount (unit) of the measuredanalyte. For example, in one embodiment, a sensor has a sensitivity (orslope) of from about 1 to about 300 picoAmps of current for every 1mg/dL of glucose analyte.

The term “current density,” as used herein, is a broad term, and is tobe given its ordinary and customary meaning to a person of ordinaryskill in the art (and is not to be limited to a special or customizedmeaning), and refers without limitation to an amount of electricalcurrent per area produced by a predetermined amount (unit) of themeasured analyte. For example, in one embodiment, a sensor has asensitivity (or slope) of from about 3 to about 1,000 picoAmps ofcurrent per mm² of electroactive surface, for every 1 mg/dL of glucoseanalyte.

The term “chamber,” as used herein, is a broad term, and is to be givenits ordinary and customary meaning to a person of ordinary skill in theart (and is not to be limited to a special or customized meaning), andrefers without limitation to a partially or fully enclosed space (e.g.,chambers, conduits, channels, capillaries, tubes, wells, cells, vessels,microchannels, or the like).

Overview

FIG. 1A provides a schematic diagram of one embodiment of an automated,continuous system 100 for manufacturing continuous analyte sensors,whereby an elongated conductive body 110 is continuously advancedthrough a series of stations, each of which treats the elongatedconductive body 110. As shown, these stations can include, but are notrequired to include, a coating station 120 for depositing coatingmaterial (e.g., insulating, conductive, or membrane material) onto theelongated conductive body 110, a thickness control station 130 forremoving excess coating material from the elongated conductive body 110,a drying/curing station 140 for curing the coating material on theelongated conductive body 110, and a thickness measurement station 150for measuring the thickness of the elongated conductive body 110(including any coatings thereon). During the coating process, theelongated conductive body 110 can be advanced through this series ofstations repeatedly, i.e., by making multiple repeated passes, until apreselected thickness has been formed on the elongated conductive body.The system 100 described herein is merely exemplary, and some stationsmay be omitted or replaced by other stations.

Although not shown in FIG. 1A, in some embodiments, the system can alsoinclude an etching station for removing or stripping portions of acoated assembly structure on the elongated conductive body (e.g., tocreate window regions corresponding to working electrodes on theelongated conductive body). Etching to create window regions can beachieved by removing a portion of the insulating layer, conductivelayer, or the like, from the elongated conductive body, using ablation(e.g., laser skiving), chemical etching, or other known techniques.Additionally or optionally, the system can also include a pre-coatingtreatment station for pre-cleaning the elongated conductive body beforethe coating process, and a post-coating treatment station forpost-cleaning after the coating process. Additionally or optionally, thesystem can also include a singulation station for cutting the elongatedconductive body into individual pieces corresponding individual sensors.

The system 100 can also be equipped with an automated control systemcomprising detector elements, control elements, and a processor 160. Thedetector and control elements can be embedded in the stations anddisposed anywhere on or near the pathway of the elongated conductivebody 110. The detector elements are configured to transmit to theprocessor 160 signals relating to certain process conditions of thesystem 100, such as, for example, the temperature of the coatingsolution, the humidity of the atmosphere immediately around a region ofthe elongated conductive body which is undergoing or about to undergomeniscus coating or laser ablation, the rate at which the elongatedconductive body 110 is advancing, or the last measured thickness of theelongated conductive body 110. The processor 160 is programmed toprocess these input signals and transmit output signals to controloperation of the control elements, e.g., valves, motors, pumps,agitators, heat lamps, die opening, etc., so that preselected processconditions for optimum controlled coating processing can be achieved andmaintained. By managing the processing conditions at a predeterminedoptimal level, the yield and reproducibility of the continuous analytesensors fabricated can be increased.

In some embodiments, a detector element in the form of a temperaturetransducer (e.g., a thermistor) and a control element in the form of aheat source (e.g., a heat lamp) is disposed at certain positions alongthe pathway of the elongated conductive body 110 to provide temperaturecontrol of the elongated conductive body 110. During operation, if thetemperature transducer detects a temperature that is less than apreselected temperature range, the temperature transducer is configuredto transmit a signal to the processor 160, which in turn responds bytransmitting a signal to activate the heat source to heat the elongatedconductive body 110 to the preselected temperature. In furtherembodiments, the heat source is positioned near the entrance of thecoating station 120, so that the elongated conductive body 110 is heatedto a preselected temperature that facilitates the coating process.Alternatively or additionally, a heat source can be provided near theexit of the coating station 120 to speed the evaporation of residualsolvent on the elongated conductive body 110.

In the embodiment shown in FIG. 1A, the system 100 comprises a transportmechanism 170 for sequentially advancing the elongated conductive body110 through the various stations. In this particular embodiment, thesystem 100 employs a reel-to-reel mechanism comprising a motor (notshown in FIG. 1A), a rotatable supply spool 172, and a rotatable returnspool 174. During operation, the elongated conductive body 110 isattached to both the supply spool 172 and the return spool 174. Althoughin some embodiments, the elongated conductive body is configured tosequentially advance through the stations in a horizontal orsubstantially horizontal arrangement, in other embodiments, a verticalor substantially vertical arrangement can also be used for one or moreof the stations, for example, to address any gravity-induced saggingissues with respect to a fresh coating on the elongated conductive body.

It is contemplated that any of a variety of transport mechanisms can beused to advance the elongated conductive body 110. For example, FIGS. 2Aand 2B, illustrate a side view and a front view, respectively, of oneembodiment of a transport mechanism 270 comprising a spool 276, suitablefor use as a supply spool, a return spool, or any other spool employedby the system. The spool 276 can include a reel 278 mechanicallyconnected to a motor 271 via a rotatable shaft 273. The motor 271 can beany of a variety of conventional motors suitable for the applicationscontemplated. The reel 278 can be any type of reel upon which theelongated conductive body can be wound, and can comprise a softmaterial, such as silicone rubber, polyurethane, or nylon, for example,that will not cut away at coatings on the elongated conductive body andwill not allow the elongated conductive body to slide freely over thereel when the reel is rotated. The diameter and width of the reel 278can be varied depending in part on the dimensions of the elongatedconductive body and other design considerations. In some embodiments,reels with a small width can be employed where there are tight spaceconstraints. In these embodiments, coils of the elongated conductivebody on the reel can overlap and touch portions of adjacent coils. Inother embodiments, however, reels having a large width can be desirable,such that the coils can be arranged to not touch each other. In someembodiments, reels with large diameters can be used, resulting in asmaller bend radius, thereby minimizing the risk that materials on theelongated conductive body will crack or chip off.

Although in the embodiment shown in FIG. 1A, the system 100 comprisesone supply spool 172 and one return spool 174, in other embodiments thesystem can comprise any number of spools. For example, in otherembodiments, the system can comprise two, three, four, five, or moresupply spools associated with an equal number or a different number ofreturn spools.

In addition, the system can comprise any number of stations. Asillustrated in FIG. 1C, in one exemplary embodiment, the system cancomprise three supply spools 173 a, 173 b, 173 c that provide threeelongated conductive bodies 110 a, 110 b, 110 c, each of which are woundinto a single take-up spool 175. In this particular embodiment, thesystem comprises one coating station 120, three thickness controlstations 130 a, 130 b, 130 c, one drying/curing station 140, and threethickness measurement stations 150 a, 150 b, 150 c. In otherembodiments, the system can comprise any number of station combinations.For instance, in one embodiment, the system can comprise five coatingstations, five thickness control stations, one drying/curing station,and one thickness measurement station. In another embodiment, the systemcan comprise three coating stations, three thickness stations, threedrying/curing stations, and one thickness measurement station.

In yet another embodiment, as illustrated in FIG. 1D, the system cancomprise four stations, each of which is configured to treat multipleportions of the elongated conductive body 110. In this particularembodiment, the elongated conductive body 110 is unwound from a supplyspool 173 and becomes engaged with a first guide roller 178 that guidesthe elongated conductive body 110 to a coating station 120. Thereafter,the elongated conductive body 110 is advanced through a thicknesscontrol station 130, a drying/curing station 140, and a thicknessmeasurement station 150. After exiting the measurement station 150, theelongated conductive body 110 engages a second guide roller 179, bywhich it is returned to the first guide roller 178. As illustrated inFIG. 1D, the elongated conductive body 110 is then advanced throughadditional coating station/thickness control station/drying/curingstation/thickness measurement station series/sequences. After passingthrough a preselected number of the aforementioned series/sequences, theelongated conductive body 110 is advanced to the second guide roller179, by which it is wound into the take-up spool 175. Although in theembodiment illustrated in FIG. 1D, the system is configured to providefive series/sequences of stations; in other embodiments the system cancomprise a different number of series/sequences. For example, the systemcan be configured to provide two, three, five, six, seven, or moreseries/sequences of stations.

As shown in FIGS. 1C and 1D, in some embodiments, the system can includeone or more pulleys or guide rollers 177, 178, 179 for guiding theelongated conductive body 110 as it advances through the variousstations of the system 100. The guide rollers can be positioned at anysuitable location along the pathway of the elongated conductive body110. For example, in one embodiment, a guide roller can be disposed at aposition near the entrance of a certain station, such as the coatingstation 120. In another embodiment, a guide roller can be disposed at aposition near the exit of a certain station, such as a thickness controlstation 130. In yet another embodiment, guide rollers can be disposednear both the entrance and exit of a certain station. In otherembodiments, the system does not use guide rollers, but instead uses thetension present in the elongated conductive body 110 (derived from thetransport mechanism 170) to guide it along its pathway as it advancesthrough the various stations.

In the embodiment shown in FIG. 1A, the pathway of the elongatedconductive body 110 is a cyclical pathway, i.e., the pathway extendsfrom the supply spool 172 to the return spool 174, and then extends backto the supply spool 172 from the return spool 174. In other embodiments,however, the pathway may not be cyclical, but is single directionalinstead. As illustrated in FIG. 1B, in some of these embodiments, theelongated conductive body 110 is unwound from a supply spool 173 andwound into a take-up spool 175, after which it can be retrieved by anoperator and loaded onto another system for further processing.

In some embodiments, each of the spools is associated with a motorconfigured to drive the spool. In other embodiments, one or more of thespools is not associated with a motor. For example, in one embodiment,wherein the pathway is single direction, the transport mechanism cancomprise a take-up spool driven by a motor to rotate at a preselectedspeed of rotation, while a corresponding supply spool is maintainedeffectively freely rotatable. More specifically, in this embodiment,whereas rotation of the take-up spool is actively driven by a motor,rotation of the supply spool is driven by translational forces from themoving elongated conductive body, as it is driven by the rotatingtake-up spool. When the transport mechanism is activated, the torqueexerted by the take-up spool provides tension to the elongatedconductive body as it unwinds from the supply spool, advances throughthe various stations of the system, and eventually winds into thetake-up spool. An increase in the torque exerted by the take-up spoolmay also increase the tension present in the elongated conductive body.

The tension present in the elongated conductive body 110 can be measuredby any of a variety of tension detectors. For example, in someembodiments, a tension detector is disposed at various positions alongthe pathway of the elongated conductive body 110 to directly measure itstension. In other embodiments, the tension is indirectly measured bymeasuring the torques exerted by the various spools and calculating thetorque differences between the spools. If the tension is determined tobe greater or less than a preselected value, the tension detector can beconfigured to transmit a signal to the processor, which is programmed todetermine whether a problem exists (e.g., a severed elongated conductivebody or one detached from the reel). If the determination is positive,the system can optionally respond with an alert or alarm to notify anoperator.

In some of the embodiments described herein, the transport mechanism 170is configured to advance the elongated conductive body 110 at a constantor substantially constant preselected speed. Selection of thepreselected speed can depend in part on design considerations associatedwith certain preselected process conditions (e.g., the preselectedviscosity and solids content of the coating solution, suspension,dispersion, or other liquid comprising the coating material) that willprovide optimal coating thickness control. In some embodiments, theelongated conductive body is configured to advance at a preselectedspeed greater than about 0.5 cm per minute, or greater than about 10 cmper minute, or greater than about 25 cm per minute, or greater thanabout 50 cm per minute, or even greater than about 250 cm per minute. Inalternative embodiments, a variable-speed transport mechanism can beused to advance the elongated conductive body at varying speeds. Forexample, in some embodiments, the transport mechanism can be configuredto periodically halt the advancement of the elongated conductive body.

To confirm that the elongated conductive body is advancing at thepreselected speed, a speed measurement system (e.g., a vision system)can be employed to measure the elongated conductive body's actual speed.If the measured speed is not within a certain range of the preselectedspeed, the vision system is configured to transmit a signal to theprocessor, which in turn can adjust motor settings in response.

While the transport mechanism has been described hereinabove withrespect to a reel-to-reel embodiment, the elongated conductive body 110may also be advanced through the series of stations with any of avariety of other transport mechanisms, such as, for example, a roboticsystem, a conveyor system, and other like systems. These other transportmechanisms may be used in combination with (or as an alternative to) areel-to-reel system. For example, in one embodiment, a reel-to-reelsystem is used to move the elongated conductive body 110 before it issingulated into individual pieces 110′, and a robotic system is used tomove the individual pieces 110′ after the singulation process.

FIG. 1E illustrates one embodiment of a robotic system 180, which canrange in size from a large device suitable for industrial scale use to asmall device suitable for laboratory bench tops. Robotic systems may beadvantageous in certain instances because they can provide accurate,precise positioning of the elongated conductive body 110′ in two orthree dimensions. In addition, they are highly flexible andreconfigurable, which can be advantageous for facilitating the physicaltransfer of individual pieces to/from a variety of stations, vessels,containers, chambers, or the like. Referring back to FIG. 1E, therobotic system 180 comprises an elongated conductive body holder 182(e.g., a robot arm) designed to move an elongated conductive body 110′through variable programmed motions for performance of a variety oftasks (e.g., for transferring the elongated conductive body 110′ fromone coating vessel 184 to another 186 for different coatingapplications, and from one station to another for a variety oftreatments). Although in the embodiment illustrated in FIG. 1E, theelongated conductive body holder 182 is shown holding a four elongatedconductive bodies 110′, in alternative embodiments, the elongatedconductive body holder 182 may be capable of holding any number ofelongated conductive bodies 110′.

In certain embodiments, the elongated conductive body holder 182 iscapable of both vertical movements and horizontal movements (e.g.,linear or rotational), thereby allowing not only for movement betweenstations, vessels, containers, chambers, or the like, but also formovement that causes the elongated conductive body 110′ to be submergedor dipped in a coating solution of a coating vessel 184, or movementthat causes the elongated conductive body 110′ to be placed into acuring or drying chamber 188. By using an elongated conductive bodyholder 182 capable of various programmed movements, both the number oftimes and the length of time that an elongated conductive body 110′ isin a station or is being coated, cured, dried, or treated in a vessel orchamber can be controlled. By way of example and not to be limiting, therobot's elongated conductive body holder 182 can be instructed to dipthe elongated conductive body 110′ (i.e., post-singulation in the formof an individual piece) into the coating vessel 184 for a plurality ofdips, with each dip interspersed by drying or curing of the coating.While the coating process has been described hereinabove primarily withrespect to a dipping technique, it should be understood that any of avariety of other coating techniques, such as, for example, spraying,electro-depositing, dipping, or casting, may also be used in addition to(or as an alternative to) dipping. For instance, in certain embodiments,the elongated conductive body holder 182 is instructed to place theelongated conductive body 110′ in a position for one or more sprayingsessions with a certain coating material to form a particular layer ofthe membrane, and then to dip the elongated conductive body 110′ for oneor more coating sessions in a coating solution to form another layer.The length of time of each dip/spray session and the length of timebetween each session can be varied or constant.

In one embodiment involving the robotic system 180, the elongatedconductive body 110′ (in the form of an individual piece) is dipped oneor more times for a predetermined time period in a pretreatmentsolution, then dipped one or more times for a predetermined time periodinto a solution containing a material that is to form the electrodeand/or interference layer, then dipped one or more times for apredetermined time period into a solution containing a material that isto form the enzyme layer, and then dipped one or more times (for apredetermined time period) into a solution containing a material that isto form the diffusion resistance layer. Before, after, and between thedips/sprays, the elongated conductive body 110′ may be treated (e.g.,conditioned, cleaned, cured, dried, etc.) or else maintained undernormal ambient conditions. It should be understood that the processdescribed above is merely exemplary, and some steps may be omitted orreplaced by other steps.

Elongated Conductive Body

Any of a variety of elongated conductive bodies can be treated by thesystems and methods described herein. FIG. 7A illustrates one embodimentof an elongated conductive body comprising an elongated core 710, afirst layer 720 that at least partially surrounds the core 710, a secondlayer 730 that at least partially surrounds the first layer 720, and athird layer 740 that at least partially surrounds the second layer 730.These layers, which collectively form a coating assembly structure, canbe deposited onto the elongated core by any of a variety of techniques,such as, for example, by employing the coating processes describedelsewhere herein. In some embodiments, the first layer 720 can comprisea conductive material, such as, for example, platinum, platinum-iridium,gold, palladium, iridium, graphite, carbon, a conductive polymer, analloy, and/or the like, configured to provide suitable electroactivesurfaces for one or more working electrodes. In certain embodiments, thesecond layer 730 can correspond to an insulator and comprise aninsulating material, such as a non-conductive (e.g., dielectric)polymer, such as polyurethane, polyimide, polyolefin (e.g.,polyethylene), for example. In some embodiments, the third layer 740 cancorrespond to a reference electrode and comprise a conductive material,for example, a silver-containing material, including, but not limitedto, a polymer-based conducting mixture.

FIG. 7C illustrates another embodiment of an elongated conductive body.In this embodiment, in addition to an elongated core 710, a first layer720, a second layer 730, and a third layer 740, the elongated conductivebody further comprises a fourth layer 750 and a fifth layer 760. In afurther embodiment, the first layer 720 and the second layer 730 can beformed of a conductive material and an insulating material,respectively, similar to those described in the embodiment of FIG. 7A.However, unlike the embodiment of FIG. 7A, in this particularembodiment, the third layer 740 can be configured to provide the sensorwith a second working electrode, in addition to the first workingelectrode provided by the first layer 720. In this particularembodiment, the fourth layer 750 can comprise an insulating material andprovide insulation between the third layer 740 and the fifth layer 760,which can correspond to a reference electrode and comprise theaforementioned silver-containing material. It is contemplated that othersimilar embodiments are possible. For example, in alternativeembodiments, the elongated conductive body can have 6, 7, 8, 9, 10, ormore layers, each of which can be formed of conductive or non-conductivematerial.

FIGS. 8A and 8C illustrate other embodiments of the elongated conductivebody. In the embodiment illustrated in FIG. 8A, the elongated conductivebody comprises three elongated cores 810A, 810B, and 810C located in(e.g., embedded in, coated with) the insulator 830. FIG. 8C illustratesanother embodiment of the elongated conductive body comprising threeinsulated conductive bodies, wherein each insulated conductive bodyincludes an elongated core 810A, 810B, and 810C coated with an insulator804A, 804B, and 804C). In some embodiments, the elongated cores (e.g.,coated with insulator) are bundled together, such as by an elastic band,an adhesive, wrapping, a shrink-wrap or C-clip, as is known in the art.In other embodiments, the inner bodies (e.g., coated with insulator) aretwisted, such as into a triple-helix or similar configuration. In oneembodiment, two of the elongated cores (e.g., coated with insulator) aretwisted together to form a twisted pair, and then a third core (e.g.,with insulator) and/or elongated conductive body is twisted around thetwisted pair. In some embodiments, the sensor can comprise additionalelongated cores.

While in some embodiments described herein, the elongated core is shapedlike a wire and has a circular cross-section, in other embodiments thecross-section of the elongated core can be oval, square, rectangular,triangular, polyhedral, star-shaped, C-shaped, T-shaped, X-shaped,Y-Shaped, irregular, or the like. The elongated core can be formed ofany of a variety of suitable material, such as, platinum,platinum-iridium, gold, palladium, iridium, graphite, carbon, conductiveor non-conductive polymer, alloys, glass, for example. In someembodiments, the elongated core comprises an inner core and a firstlayer, wherein an exposed electroactive surface of the first layerprovides the working electrode of the continuous analyte sensor beingmanufactured. For example, in some embodiments, the inner core comprisesstainless steel, titanium, tantalum and/or a polymer, and the firstlayer comprises platinum, platinum-iridium, gold, palladium, iridium,graphite, carbon, a conductive polymer, and/or an alloy.

The elongated conductive body can be designed (e.g., by materialselection, by diameter selection, by treatment) to have certainmechanical properties. For instance, an elongated conductive body may bedesigned to meet a certain minimal level of tensile strength or minimallength of diameter, so that the elongated conductive body will not beprone to breakage during a reel-to-reel processing. In some embodiments,the tensile strength of the elongated conductive body is at least about200 MPa, or at least about 500 MPa, or at least about 1,000 MPa, or atleast about 2,000 MPa, or even at least about 5,000 MPa. In certainembodiments, the diameter of the elongated conductive body is at leastabout 5 microns, or at least about 15 microns, or at least about 25microns, or at least about 50 microns, or at least about 75 microns, orat least about 100 microns, and or even at least about 200 microns.Other possible embodiments and features of the elongated conductive bodyare described in U.S. Provisional Application No. 61/222,751, thecontents of which are incorporated by reference herein in its entirety.

Workpiece Station

The material that eventually forms the elongated conductive body mayinitially be in the form of one or more workpieces. The workpiece may beformed of any of a variety of materials, such as, for example, platinum,platinum-iridium, gold, palladium, iridium, graphite, carbon, conductivepolymers, and alloys or combinations thereof. In some embodiments, theinitial workpiece possesses the desired dimensions, shapes, andmechanical specifications, and thus minimal (or no) substantialmechanical or structural changes need to be made to the workpiece beforeit is treated and processed (e.g., coated, dried, etched, singulated,etc.) to form a continuous analyte sensor. In certain embodiments, theinitial workpiece may already possess the desired shape (e.g., wire,tube, planar substrate, etc), but not the desired dimensions. In theseembodiments, processing may involve resizing the workpiece to thedesired dimensions.

In other embodiments, however, the initial workpiece does not possessany of the above-described desired specifications and properties, andthus the workpiece has to undergo processing, whereby the workpieceitself is worked on by machine or hand tools to impart structural and/ormechanical changes. These changes may involve, for example, cutting orshaping of the workpiece. They can also involve the addition of a layer(e.g., coating, cladding, plating, etc.) that circumscribes the outersurface of the workpiece. For example, the elongated conductive body maybe fabricated to include a core and a cladding surrounding the core,both of which are formed from different materials. In some instances,fabricating the elongated conductive body to have a core formed with aless expensive, yet strong and flexible material (e.g., palladium,tantalum, stainless steel, or the like) and a thin layer of a moreexpensive material (e.g., platinum) to form the electroactive surface ofthe continuous analyte sensor, can enable a substantial reduction in thematerial costs required to build the continuous analyte sensor.

In one embodiment, fabrication of the elongated conductive body can beperformed by inserting (e.g., by slip fitting) a rod or wire into atube, the combination of which forms an initial structure of anelongated conductive body. The rod or wire may be formed of any of avariety of materials including, but not limited to, stainless steel,titanium, tantalum, and/or a polymer. The tube may be formed of aconductive material, such as, for example, platinum, platinum-iridium,gold, palladium, iridium, alloys thereof, graphite, carbon, or aconductive polymer. Alternatively, instead of using a tube to form thecladding, a layer of conductive material may be deposited onto the core.Deposition of the conductive material may be performed by any of avariety of techniques, such as, for example, chemical vapor deposition,physical vapor deposition (e.g., sputtering, vacuum deposition),chemical and electrochemical techniques, dip coating, spray coating, andoptical coating. In some embodiments, the dip coating and spray coatingprocesses described elsewhere herein may be used to deposit a coatinglayer onto the outer surface of the rod or wire.

After a cladding/plating/layer has been formed around the rod or wire,the elongated conductive body can then be passed through a series ofdies to draw down the diameter of the elongated conductive body from alarge diameter to a small diameter. With each pass through the die(e.g., a diamond die), the cross-sectional profile of the elongatedconductive body is compressed, and the diameter associated therewith isreduced. It has been found that while compression tends to increase thetensile strength of the elongated conductive body, compression alsotends to increase susceptibility of the elongated conductive body tobrittleness, stress cracking, and even breakage. Accordingly, in someembodiments, an annealing step is used to cause changes in themechanical and structural properties of the elongated conductive body,and more specifically, to relieve internal stresses, refine thestructure by making it homogeneous, and improve cold working properties.It has also been found that drawing down the diameter of the elongatedconductive body through large numbers of dies in small incrementalsteps, instead of through one or a few number of large incrementalstep(s), can result in better mechanical and structural properties.Accordingly, in some embodiments, the elongated conductive body ispassed through a series of dies, with each successive die having aprogressively smaller diameter. Between each die passing, the elongatedconductive body may undergo an annealing treatment (e.g., by using anannealing oven), through which the elongated conductive body is softenedand its ductility increased.

FIG. 10A illustrates one embodiment of a die 1050 used to compress theelongated conductive body, so as to reduce its cross-sectional profile.FIG. 10B provides a view of the die on lines 10B-10B of FIG. 10A. Asshown, the die 1050 comprises an orifice 1020, a front portion 1012,through which an elongated conductive body 1010 enters the die 1050, anda back portion 1014, through which the elongated conductive body 1010exits. The edge 1016 of the front portion 1012 may have a tapering angleα defined by the longitudinal axis 1018 of die 1050 and the front edge1016. The elongated conductive body 1010 is drawn through a die 1050(e.g., diamond die, etc.) and through its orifice 1020. In someembodiments, the shape and dimensions of the orifice 1020 may bechanged, so that the elongated conductive body can be shaped and sizedto have any desired cross sectional shape and dimensions.

As the elongated conductive body 1010 is forced through the die orifice1050 to impart a shape or to reduce dimensions, the elongated conductivebody 1010 becomes deformed. Drawing the elongated conductive body 1010through a die with a large tapering angle will cause greater compressionof the elongated conductive body 1010 than a die with a smaller taperingangle. Accordingly, drawing the elongated conductive body 1010 through aseries of dies with large tapering angles may minimize the number ofdies that an elongated conductive body has to be drawn through. However,it has been found that drawing the elongated conductive body 1010through a successive number of dies, each with a smaller tapering angle,can substantially reduce the risk of breakage, brittleness, stresscracking, or other mechanical deficiencies that may be imparted on theelongated conductive body 1010. In some embodiments, the tapering angleα of the die is less than about 60 degrees, sometimes less than about 45degrees, sometimes less than about 30 degrees, sometimes less than about30 degrees, and sometimes less than about 10 degrees.

With certain embodiments (e.g., an elongated conductive body in the formof a wire), obtaining and maintaining concentricity of the elongatedconductive body is important. Without concentricity of the elongatedconductive body, subsequent coatings of the conductive, insulating, andmembrane materials may not be uniform, and consequently performance ofthe fabricated continuous analyte sensor may be negatively impacted. Forelongated conductive bodies with circular (or substantially circular)cross-sectional shape, a lack of uniformity of compressive forcesexerted on the cross-sectional circumference of the elongated conductivebody, can lead to loss of concentricity between the core and theclad/plate/layer and thereby cause certain portions of the elongatedconductive body to be thicker than other portions. Accordingly, in someembodiments, the die 1050 is configured to cause the elongatedconductive body 1010 to compress in a way such that compressive forcesexerted on the cross-sectional circumference of the elongated conductivebody are substantially uniform across the circumference, so thatconcentricity can be maintained. The risk of concentricity loss may alsobe reduced by use of a positioning system (e.g., a vision system) thatmay be disposed near or along the die 1050. The positioning system canbe used to confirm that the elongated conductive body 110 is alignedcorrectly during its entry into and exit out of the die 1050, and thatit is moving along a certain predetermined path (e.g., a path that isperpendicular to the plane defined by the orifice 1020). As anadditional measure to minimize the risk of concentricity loss, portionsof the die 1050, such as the orifice 1020, may be coated with alubricant (e.g., oil) to reduce any buildup of friction associated withthe advancement of the elongated conductive body 1010 through the die1050.

In some embodiments involving a wire-shaped elongated conductive bodywith a substantially circular cross-sectional profile, the workpiecestation comprises a series of dies, which collectively are capable ofreducing the thickness of the elongated conductive body, while stillsubstantially maintaining the concentricity of the elongated conductbody. In these embodiments, the reduction in thickness corresponds tothe reduction from an original elongated conductive body diameter of upto about 250 microns, sometimes up to about 500 microns, sometimes up toabout 1,000 microns, and sometimes up to about 2,500 microns, to a finaldiameter no less than about 100 microns, sometimes no less than about 50microns, sometimes no less than about 25 microns, and sometimes no lessthan about 13 microns.

In addition (or as an alternative) to the treatments described above,the elongated conductive body can undergo any of a variety of processingto change its physical (and sometimes chemical) properties. For example,the elongated conductive body can undergo annealing, quenching,tempering, drawing, rolling, normalizing, work hardening, and/or worksoftening processes, so that the elongated conductive body acquirescertain desired physical properties.

Etching Station

The automated, continuous system for manufacturing continuous analytesensors may comprise an etching station, whereby portions of the coatedassembly structure is stripped or otherwise removed. In someembodiments, removal of portions of deposited layers of coating can beperformed to expose the one or more electroactive surface(s) of theelongated conductive body, thereby forming recessed regions or windowregions/surfaces 420 corresponding to working electrodes. The terms“etching” and “etched” as used herein are broad terms, and are to begiven their ordinary and customary meaning to a person of ordinary skillin the art (and are not to be limited to a special or customizedmeaning), and refer without limitation to a mechanism for forming one ormore recessed regions within the elongated conducted body. It should beunderstood that the terms “etching” and “etched” as used herein is notlimited to chemical etching. Rather, as used herein, “etching” and“etched” can also include, but are not limited to, techniques, such aslaser etching/ablation/skiving, grit-blasting (e.g., with sodiumbicarbonate or other suitable grit), or the like, that can be employedto expose certain surfaces of the elongated conductive body (e.g., theelectroactive surfaces corresponding to a conductive layer or a surfacecorresponding to an insulating layer).

Achieving accuracy and precision with respect to the particular depth ofone or more materials of a coated assembly which are removed by etchingcan be important. Without precision and accuracy (e.g., for certainembodiments involving an elongated conductive body with a circular orsubstantially circular cross-section), uniformity of ablation depth maynot be achieved, and thus concentricity of the elongated conductive bodymay be lost. Without achieving and maintaining concentricity with aproximal layer of the elongated conductive body, any subsequent (i.e.,distal) layers coated over the proximal layer would also not haveconcentricity. Loss of concentricity can result in certain portions ofthe elongated conductive body being thicker than other portions, whichin turn, can negatively affect sensor performance (e.g., accuracy).

In some embodiments, the etching process involves etching a single layerof material (e.g., etching only an insulating layer or a conductivelayer), but in other embodiments, the etching process involves etching aplurality of layers (e.g., both a conductive layer and an insulatinglayer), such as two, three, four, five, or more layers. In certainembodiments, portions of the elongated conductive body can be maskedprior to depositing the insulating layer in order to maintain an exposedelectroactive surface area.

As noted above, in some embodiments, laser ablation is used to removecertain layers that have been deposited on the elongated conductivebody. Removal of layers can be performed to expose electroactivesurfaces on the elongated conductive body or else merely to removecertain insulating or conductive layers or portions thereof. During thelaser ablation process, a laser beam, which can be pulsed and have aparticular wavelength and power selected to ablate the desired layers,portions, or patterns, is directed at certain portions of the elongatedconductive body to irradiate the layers in accordance with a preselectedpattern. The pattern can be controlled by the processor to provide forspacings between the portions of the elongated conductive body that areablated. In certain embodiments, these spacings are from about 5 mm toabout 50 mm, or from about 10 mm to about 30 mm, or even from about 20mm to about 25 mm.

The power, duration of the laser pulse, repetition rate of the laserpulse, and speed of the laser can be varied to control the speed of theablation, the amount of material ablated, and the depth of the ablation.The selected ablation settings may depend on the shape, size, and otherphysical properties of the elongated conductive body. They may alsodepend on the ablation depth, area, or shape desired. By controlling theparameters described above, the risk of the ablation process leaving asubstantial amount of residual ablation debris on the elongatedconductive body can be minimized. In some embodiments relating to laseretching of polyurethane, the laser beam has a wavelength of from about100 nm to about 800 nm, or from about 200 nm to about 300 nm, or fromabout 220 nm to about 265 nm, or even from about 245 nm to about 250 nm.

In certain embodiments, the elongated conductive body is spun around itslongitudinal axis as a laser beam is directed on the elongatedconductive body. In further embodiments, the rotation rate is greaterthan about 0.5 revolutions per second, or greater than about 1revolution per second, or greater than about 2 revolutions per minute,or greater than about 5 revolutions per minute, or even greater thanabout 10 revolutions per minute. The laser beam can be generated by anyof a variety of laser sources, such as, an excimer laser, YAG laser, CO2laser, diode laser, for example. The laser beam energy beam density canbe established to be sufficient to ablate or remove a layer or portionfrom the elongated conductive body at a certain predetermined depth andarea, but low enough so as to not damage the layers and materialsoutside the predetermined depth and area. The laser beam energy beamsetting can also selected in consideration of the type of material(s)that is the target of the ablation. In some embodiments, the laserablation process involves directing a beam to remove a small fraction ofthe total thickness (e.g., a few microns) of a layer with every pulse orpass. Multiple passes are then performed, so that the desired ablateddepth is achieved. In certain embodiments, with every pulse or pass, acoating material corresponding to a depth of 0.5 microns from thesurface is removed, or a coating material corresponding to a depth of 1micron from the surface is removed, or a coating material correspondingto a depth of 1.5 micron from the surface is removed, or a coatingmaterial corresponding to a depth of 2 microns from the surface isremoved, or a coating material corresponding to a depth of 2.5 micronsfrom the surface is removed, or a coating material corresponding to adepth of 3 microns from the surface is removed, or a coating materialcorresponding to a depth of 5 microns from the surface is removed, oreven a coating material corresponding to a depth of 10 micron from thesurface is removed.

In certain embodiments, instead of using a single laser beam, multiplelaser beams (e.g., two, three, four, or five laser beams) can bedistributed around the elongated conductive body. In some of theseembodiments, the elongated conductive body may not be configured torotate during the laser ablation process. Instead, the plurality oflaser beams around the elongated conductive body can be configured toturn on simultaneously, sequentially, or in some preselected pattern toremove the desired portion or pattern. A multi-beam arrangement can beobtained by using multiple laser sources, or by using one laser sourceand dividing the laser beam from this source into multiple branches withuse of beamsplitters. Each of the smaller beams can then be guided orredirected with individual optical components such as mirrors andlenses, so that the beams are directed to the elongated conductive bodyfrom different directions or angles. From this, multiple laser beams canbe distributed around a perimeter or circumference of a cross section ofthe elongated conductive body to remove a layer all around the perimeteror circumference of the elongated conductive body. In alternativeembodiments, only certain preselected sections of a perimeter orcircumference of the elongated conductive body cross section areremoved.

FIG. 7B illustrates one embodiment of the elongated conductive body ofFIG. 7A, after it has undergone laser ablation treatment. As shown, awindow region 722 is formed when the ablation removes the second andthird layers 730, 740, to expose an electroactive surface of the firstconductive layer 720, wherein the exposed electroactive surface of thefirst conductive layer 720 correspond to a working electrode. In theembodiment illustrated in FIG. 7B, the laser ablation treatment of theelongated conductive body is carried out in steps, as evidenced by themulti-stepped topography. In a first step, a segment of the third layer740 is ablated, and in a second step, a segment of the second layer 730is ablated. In this embodiment, the segment of the third layer 740removed is longer than the segment of the second layer 730 removed.Accordingly, the risk of third layer material falling onto the exposedelectroactive surfaces of the first layer 720 may be minimized.Alternatively, in other embodiments, a single step ablation method canbe employed, whereby both the second and third layers 730, 740, areremoved simultaneously.

FIG. 7D illustrates one embodiment of the elongated conductive body ofFIG. 7C, after it has undergone laser ablation treatment. Here, twowindow regions, a first window region 722 and a second window region742, are formed, with each window region having a different depth andcorresponding to a working electrode distinct from the other. Aspreviously described, a multi-step laser ablation treatment can beemployed. In forming the first window region 722, in a first step, asegment of the third, fourth, and fifth layers 740, 750, 760 aresimultaneously removed. In a second step, a segment of the second layer730 is removed to expose electroactive surfaces of the first conductivelayer 720. As illustrated in FIG. 7D, in this particular embodiment, thesegment of the second layer 720 that is removed is shorter than thatremoved of the third, fourth, and fifth layers 740, 750, 760, tominimize the risk of third, fourth, and fifth layer materials fallingonto the exposed electroactive surfaces of the first layer 720.Similarly, in forming the second window region 744, in a first step, asegment of the fifth layer 760 is removed, and in a second step, asegment of the fourth layer 750 shorter than that of the fifth layer 760is removed.

FIGS. 8B and 8D illustrate the elongated conductive bodies illustratedin FIGS. 8A and 8C, respectively, after they have undergone ablationtreatment. As shown in FIG. 8B, the ablation treatment removes portionsof the insulator from the elongated conductive body illustrated in FIG.8A to form a plurality of window regions, thereby exposing a portion ofthe elongated cores 810A, 810B, and 810C. In this particular embodiment,window region 822A is formed in the insulator such that a portion ofelongated 810A is exposed. Similarly, window region 822B is formed inthe insulator such that a portion of elongated core 810B is exposed. Inother embodiments, the window regions can be staggered and/ornon-staggered along the longitudinal length of the sensor.

As shown in FIG. 8D, after ablation treatment, the elongated conductivebody illustrated in FIG. 8C is formed with a first window region 822Aconfigured to expose an electroactive portion of the first elongatedcore 810A and with a second window region 822B configured to expose anelectroactive portion of the second elongated core 810B. In someembodiments, the first and second elongated cores are configured tofunction as first and second working electrodes, respectively, and thethird elongated core is configured to function as a reference or counterelectrode.

In other embodiments, grit blasting is implemented to expose theelectroactive surfaces of an elongated core or conductive layer. Thiscan be performed by using a grit material that is sufficiently hard toablate the coated material, while being sufficiently soft so as tominimize or avoid damage to the underlying elongated core or conductivelayer. Although a variety of “grit” materials can be used (e.g., sand,talc, walnut shell, ground plastic, sea salt, and the like), in someembodiments, sodium bicarbonate can be used as a grit-material becauseit is sufficiently hard to ablate a certain coating (e.g., apolyurethane, polyimide, or polyethylene insulating layer) withoutdamaging an underlying core (e.g., platinum conductor). One additionaladvantage of sodium bicarbonate blasting includes its polishing actionon certain metals as it strips the polymer layer, thereby potentiallyeliminating a cleaning step that might otherwise be necessary.

In yet other embodiments, mechanical skiving can be used. Mechanicalskiving can involve using a scribe, a high speed grinder, mechanicalmachining, mechanical wheels, or other tools to impart a recess on theelongated conductive body to expose electroactive surfaces. In someinstances, mechanical skiving can be advantageous because mechanicalskiving typically results in a recessed region with a curved edge (asillustrated in FIG. 9A), instead of a recessed region with a sharp edge(as illustrated in FIG. 9B), as is typically created by a laser ablationprocess. In some instances, a recessed region with a curved edge andsurface may provide for better control of coating thickness and/orcoating thickness profile in the window region.

In yet other embodiments, chemical etching is used to expose theelectroactive surfaces. During the chemical etching process, a mask,typically formed of an organic film, is deposited onto selected regionsof the elongated conductive body, i.e., the regions not intended to beetched. The sections between the masked regions are then etched, and themask is subsequently removed.

Pre-Coating Treatment Station

Prior to the coating process, the elongated conductive body 110 can becleaned to remove organics or other surface contaminants that mayinterfere with the coating process. It is contemplated that any knownsuitable cleaning method can be used. For example, in some embodiments,the system uses an ultrasonic cleaning device comprising a cleaningvessel and a roller or pulley, for guiding the elongated conductive bodyinside the cleaning vessel. During the cleaning process, the cleaningvessel can be filled with a cleaning solvent, such as isopropanol,acetone, tetrahydrofuran (THF), or citric acid, for example. Next, theelongated conductive body is drawn through the cleaning vessel, where itis cleaned by ultrasonic sound waves and the cleaning solvent, such thatwhen the elongated conductive body exits the ultrasonic cleaning device,it is cleaned essentially free of surface contaminants.

In some embodiments, a drying chamber can be provided adjacent to theexit of the cleaning vessel. In these embodiments, as the elongatedconductive body exits the drying chamber, it passes through the dryingchamber, where residual solvent on the surface can be removed, forexample, by evaporating the solvent at a higher rate than that underambient conditions. Use of a drying chamber can drive out the solventusing any conventional methods known, such as by using heat from anevaporator or an inlet supply of heated inert gas (e.g., nitrogen), orby using vacuum evaporation, for example.

In some embodiments, the elongated conductive body can be cleaned by aplasma device, as an alternative or in addition to the ultrasoniccleaning device. In these embodiments, the elongated conductive body canbe treated within a vacuum chamber filled with an inert gas (e.g.,Argon), which is electrically charged to bombard the surface of theelongated conductive body with sufficient energy for contaminantremoval. The resulting contaminant effluent can then be removed from thedrying chamber by a vacuum pump. Because plasma cleaning does notinvolve chemical reactions, under certain conditions, it may removecertain inorganic contaminants that are not easily removed by ultrasoniccleaning or chemical processes.

In certain embodiments, the elongated conductive body can also undergosurface treatment prior to the coating process to enhance uniformity ofthe subsequent coating deposition. The surface treatment can be carriedout by any of a variety of known techniques. For example, electrostaticcharging and/or plasma surface treatment can be used to modify thesurface energy of the elongated conductive body. Using ionizing gasessuch as argon or nitrogen, plasma surface treatment can create highlyreactive species even at low temperatures. Typically, only a few atomiclayers on the surface are involved in the process, so the bulkproperties of the elongated conductive body remain substantiallyunaltered by the chemistry. In some instances, plasma surface treatmentmay reduce surface contact angles and provide adequate surfaceactivation for enhanced wetting and adhesive bonding. Other knownsurface treatments that can be used include, but are not limited to,surface washing with a solvent and corona discharge and UV/ozonetreatment.

Coating Station

FIG. 3A provides a schematic diagram of one embodiment of a coatingstation 320. As the elongated conductive body 310 advances through ameniscus 326 comprising a coating solution formed of a solvent and acoating material, the elongated conductive body's surface becomesimmersed in the coating solution. As it separates from the meniscus 326,the elongated conductive body 310 retains a coating with a layer ofsubstantially uniform thickness on its outer surface, as illustrated inFIG. 3B. A solid layer of coating material is then formed on thesurface, as the solvent portion of the coating solution evaporates.

As shown in the embodiment illustrated in FIGS. 3A and 3B, the coatingstation 320 can include a coating vessel 322 with an opening 324 at itstop configured for establishing a meniscus 326. The coating vessel 322can be formed of any of a variety of known inert materials (e.g.,ordinary glass or ceramic ware or an inert polymer such as polyethylene)suitable for the coating processes contemplated. In addition, thecoating vessel 322 can comprise a collecting section 328 for collectingoverflow. In some embodiments, the coating station 320 can comprise aninert gas source, which introduces inert gas (e.g., nitrogen, argon)into the coating station. The inert gas is subsequently removed, so asto purge certain sections of the coating station. It is contemplatedthat in some embodiments the coating station 320 can also comprise aheat source (e.g., a heat lamp) disposed somewhere near the meniscus tospeed solvent evaporation. In some embodiments, the environment in orsurrounding the coating station 320 can be controlled. For example, inone system, the coating station 320 can comprise a temperature controlunit disposed near or surrounding the coating vessel 322 to control thevapor pressure of the evaporating solvent. Additionally oralternatively, the coating station 320 can also comprise a humiditycontrol unit configured to maintain a relatively constant humidity inthe coating station 320. The temperature and humidity inside the coatingvessel 320 can each be independently above, below, or substantially thesame as the ambient temperature and humidity outside of the coatingstation 320.

The coating vessel 322 can also comprise various elements for detectingand controlling certain coating solution conditions, such as solidscontent (also commonly referred to as concentration of coatingmaterial), viscosity, and temperature. For example, the coating vessel322 can include a temperature detector, a coating material concentrationdetector, a viscosity detector, a heat exchanger, and an agitator (e.g.,a stirrer). The processor is operatively connected to detectorsconfigured to transmit signals indicative of certain coating solutionconditions to the processor. The processor is also operatively connectedto various control elements (e.g., a heater, stirrer, control valve,etc.) that can be used to adjust certain coating solution conditions.Collectively, these various elements and the processor provide aclosed-loop feedback mechanism for controlling coating solutionconditions.

The embodiments described herein are capable of producing coatings of aprecise thickness. This may be achieved in part by controlling certaincoating solution conditions, which in turn allows for thickness controlof the coating layer deposited onto the elongated conductive body. Forexample, controlling the temperature of the coating solution mayfacilitate thickness control, given that certain properties of thecoating solution, such viscosity, will vary with temperature changes. Asanother example, controlling the viscosity may also facilitate thicknesscontrol, given that a highly viscous coating solution (e.g., with a highsolids content) may sometimes present technical challenges with respectto thickness uniformity. Additionally, inconsistency in the viscosityand solids content of the coating solution between different periods ofthe coating process may cause inconsistencies in coating thicknessbetween various segments of the elongated conductive body.

During the coating process, a meniscus 326 is established at the opening324 at the top of the coating vessel 322, by activating the pump 321which drives the solution to continuously circulate at a preciselycontrolled rate. To facilitate formation of the meniscus 326, theopening 324 of the coating vessel 322 can have any of a variety ofshapes and dimensions, depending in part on the system's preselectedprocess parameters (e.g., the solution used, the temperature of thesolution, the speed at which the elongated conductive body advancesthrough the coating station, etc.). For example, in some embodiments,the opening 324 of the coating vessel 322 can be formed with a circularor substantially circular shape, but in other embodiments, the openingcan be formed with a shape that resembles an ellipse, a polygon (e.g.,triangle, square, rectangle, parallelogram, trapezoid, pentagon,hexagon, octagon), or the like. The coating vessel 322 can also have anysuitable dimension. For example, in some embodiments, the coating vesselcan have large dimensions, so as to accommodate a plurality (e.g., 3, 4,5, or 5) of elongated conductive bodies.

To prevent possible agglomeration of coating material particles in thecoating vessel 322, the coating vessel 322 can be provided with anagitator 323 (e.g., a stirrer) to ensure that the coating solution iswell mixed. The agitator 323 can also be used to prevent possiblesedimentation of coating material particles at the bottom of the coatingvessel 322. Although not shown in FIG. 3A or 3B, in some embodiments,the coating vessel can be configured to be in fluid communication with asolvent source and a coating material source. During the coatingprocess, if the concentration of the coating material is measured to beoutside a preselected range, the processor can respond by makingadjustments to various control element setting, for example, by openinga control valve to introduce a solvent or coating material into thecoating vessel, to return the coating solution to a preselectedconcentration.

Referring back to FIG. 3A, in some embodiments, the coating station 320comprises a supply vat 325 that continuously feeds solution into thecoating vessel 322 at a precisely controlled, consistent rate via a line327 and a pump 329. Accordingly, as the coating process progresses, thesolution held in the coating vessel 322 can be continuously replenishedfrom the supply vat 325. By maintaining a controlled, consistent rate offlow of the coating solution from the supply vat 325 to the coatingvessel 322, a continuous, consistent overflow flowing out of the opening324 is sustained. In addition, this flow control may allow for controlof the contour and dimensions of the meniscus, which in turn may provideconsistency of coating thickness between different segments of theelongated conductive body. Overflow flowing out of the coating vesselcan be collected by a collecting section 328, so that the overflow fluidcan be further processed, such as, recycled, replenished by combining itwith solvent and/or coating material, discarded, etc.

Although not shown, the supply vat 325 can be connected to one or morestorage tanks that feed coating material and solvent into the supply vat325. In some embodiments, the coating solution can be formed of onecoating material and one solvent. In these embodiments the supply vat325 can be connected to one storage tank holding one solvent and anotherstorage tank holding another coating material. In other embodiments, thecoating solution can be formed of a plurality of coating materialsand/or a plurality of solvents. In these embodiments, the supply vat 325can be connected to a plurality of storage tanks each holding adifferent solvent and/or a plurality of storage tanks each holding adifferent coating material. Similar to the coating vessel 322, thesupply vat 325 can also be provided with an agitator (e.g., a stirrer)to agitate the solution and mix the coating material with the solvent,to prevent possible agglomeration of coating material particles in thesupply vat 325, and to prevent possible sedimentation of coatingmaterial particles at the bottom of the supply vat 325. In someembodiments, the supply vat 325 can include a level indicator formonitoring the level of the coating solution in the supply vat 325. Ifthe fluid level falls below a certain preselected level, the levelindicator is configured to transmit a signal to the processor, so thatnew coating solution can be prepared.

As described elsewhere herein, in some embodiments, the elongatedconductive body selected to undergo the membrane coating process mayalready have been coated with one or more layers of one or morematerials (e.g., an elongated core covered with an insulating layerand/or a conductive layer). Following the ablation/etching processdescribed elsewhere herein, as illustrated in FIG. 4A, the surface ofthe elongated conductive body can have a stepped topographyconfiguration with a plurality of window regions 420, where portions ofthe insulating and/or conductive layers were previously removed. Asshown, the window regions 420 are associated with a diameter 422 (alsoreferred to herein as a window diameter 422) that is less than thediameter 432 associated with the outer surface 430 of the elongatedconductive body 410. Because of the stepped topography configuration,controlling the coating thickness on the elongated conductive body 410,particularly the thickness in the window region 420, presents varioustechnical challenges when conventional dip coating techniques are used.The embodiments described herein are configured to overcome thesechallenges by providing a mechanism that provides precise control ofcertain process parameters.

As described elsewhere herein, the system may be provided with athickness control station 130 configured to control the coatingthickness of certain portions (i.e., the unetched and/or unablatedportions) of the elongated conductive body, by removing excess coatingmaterial from its outer surface 430. However, because the dimensions ofthe die orifice of the thickness control station 130 are constrained bythe outer diameter of the elongated conductive body, a differentmechanism can be used to control the coating thickness and thicknessprofile of the window regions 420. As illustrated in FIG. 4B, depositinga coating onto a windows region 420 with a stepped topography may resultin a coating thickness profile resembling a curve. By controllingcertain process parameters, the embodiments described herein allow forprecise control over the thickness and the thickness profile of thelayers residing in the window regions. To achieve this control, in someembodiments, the meniscus coating process described herein can be used,whereby the viscosity of the coating solution, the solids content of thecoating solution, the temperature of the coating solution, the speed atwhich the elongated conductive body advances through the coatingstation, and/or the flow rate of the coating solution into the coatingvessel are precisely controlled. Each of the aforementioned processparameters affects the thickness and the thickness profile of thematerial coated on the elongated conductive body. Because the thicknessof the coating directly affects certain properties (e.g., permeabilityof the membrane system) of the continuous analyte sensor, achievingtight control of the thickness may also provide for tight control ofthese properties.

The coating thickness and the uniformity of the thickness may becontrolled by solvent selection. Depending on the applicationcontemplated, any of a variety of solvents can be used, each of which isassociated with a vapor pressure. The vapor pressure of a solventaffects the rate at which the solvent evaporates. Accordingly, solventselection may affect the thickness and/or thickness control.

Control of the viscosity can involve selection of a polymer forming thecoating material, molecular weight selection for the polymer, control ofpolymer concentration of the solution, and solution temperature control.With a low viscosity, a coating may sometimes considerably sag to thebottom surface of the elongated conductive body, resulting in a variablelayer thickness. In contrast, with a high viscosity, the coatingmaterial may be difficult to coat onto the elongated conductive body.Accordingly, it is contemplated that the system can use a coatingsolution with an appropriate viscosity which will allow for deposition,but will yet still provide for control over coating thickness andthickness profile. The molecular weight of a polymeric coating materialmay also affect the viscosity of the coating solution, with viscositygenerally increasing with molecular weight. Viscosity also oftencorrelates with temperature. Thus, in some embodiments, the temperatureof the coating solution may be controlled so that the viscosity may becontrolled. In some embodiments, the coating solution is controlled tohave a preselected viscosity of from about 0.1 to about 500 cP, or fromabout 1 to about 30 cP, or from about 50 to about 100 cP.

Control of the solids content of the coating solution may be achieved bypreparing a coating solution with a preselected concentration level, andsustaining this concentration level by constantly monitoring theconcentration and adjusting as needed. In some embodiments, the coatingsolution is controlled to have a preselected solids content of fromabout 0.1 to about 60 weight percent, or from about 1 to about 35 weightpercent, and or from about 5 to about 20 weight percent.

Control of the coating solution temperature may be achieved by use of athermistor and a heating element (e.g., a heat exchanger). In someembodiments, the coating solution is controlled to have a preselectedtemperature from about 20° C. to about 100° C., and or from about 22° C.to about 35° C.

Control of the speed at which the elongated conductive body advancesthrough the coating station can be controlled by the motor of thetransport mechanism. Generally, a slower rate of withdrawal from themeniscus results in a thicker coating along the surface of the elongatedconductive body. In some embodiments, the elongated conductive body maybe controlled to have a rate of advancement from about 1 inch/min toabout 1,000 ft/min, and or from about 1 ft/min to about 50 ft/min.

Control of the flow rate of the coating solution into the coating vesselmay be achieved by controlling the output from the one or more pumpsthat pump coating solution into the coating vessel. In some embodiments,the flow rate into the coating vessel is from about 1 mL/min to about 25mL/sec, and or from about 3 mL/min to about 7 mL/min.

Although a meniscus coating process is used coat the elongatedconductive body in some embodiments, it is contemplated that in otherembodiments, other types of coating processes can be used as analternative or in addition to the meniscus coating process. For example,as illustrated in FIG. 3C, in some embodiments, instead of beingconfigured to advance through a meniscus, the elongated conductive body310 can be configured to advance into the coating vessel 322, where itcan dwell for a preselected period of time. A plurality of rollers orpulley 372, 374, 376 can be disposed near or in the coating vessel 322to provide guidance to the elongated conductive body 310 as it advancesalong its predetermined path. By precisely controlling certain processparameters, the embodiment of the system illustrated in FIG. 3C may becapable of achieving the thickness control characteristics associatedwith the meniscus coating process described elsewhere herein.

In yet other embodiments, a coating process employing a verticalarrangement is employed. For example, as illustrated in FIG. 3D, in someembodiments, the elongated conductive body 310 can be advancedvertically upwards through a septum 330 disposed at the bottom of acoating vessel 322, through the coating vessel 322, whereupon theelongated conductive body 310 is coated with the coating solution, andthen through a thickness control device (e.g., a die 332 with an orifice334) whereby excess coating material is removed. The septum can comprisea sealing member (e.g., a gasket or a plenum) for preventing the coatingsolution from leaking out of the bottom of the coating vessel 332. Inthese particular embodiments, the excess coating material falls backinto the coating vessel 322. Similar to other embodiments describedherein, the coating vessel 322 of these embodiments can be connected toa pump 321 for circulating the coating solution and a supply vat 325 forfeeding coating solution into the coating vessel 322. In furtherembodiments, the coating vessel 322 can be equipped with a levelindicator for monitoring the level of the coating solution therein. Ifthe fluid level falls below a certain preselected level, the levelindicator is configured to transmit a signal to the processor, so thatadditional coating solution is drawn from the supply vat 325 to thecoating vessel 322 via pump 329.

Although the methods and systems described herein relate to dip coatingprocesses, it should be understood that the coating station can employany of a variety of other types of coating processes, such as spraycoating or vapor deposition. For example, in one embodiment, theelongated conductive body is advanced through a spraying tunnel. Whilepassing through the spraying tunnel, the elongated conductive body iscoated with a coating material, which can be applied using any of avariety of known spray coating techniques, such as fog spraying orelectrostatic spraying, for example. In another embodiment, a continuousmanufacturing process is contemplated that utilizes physical vapordeposition to deposit a coating material. Physical vapor deposition canbe used to coat one or more layers of material onto the elongatedconductive body. It is contemplated that in some instances, employingphysical vapor deposition to coat the elongated conductive body mayresult in consistent deposition and enhanced reproducibility.

FIG. 3E illustrates one embodiment of a coating station that employsspray coating. Similar to some of the other embodiments describedherein, in this particular embodiment, the coating station comprises acirculation pump 321 and a supply vat 325 configured to feed coatingsolution via a pump 329. In addition, this embodiment also comprises anozzle 338 for spraying a coating solution and a receiving container 336for collecting coating solution. During operation, as the elongatedconductive body 310 is advanced through the coating station, it issprayed with a jet of coating solution from the nozzle 338. Coatingsolution that falls off of the elongated conductive body is collected bythe receiving container 336. From there, the coating solution is pumpedvia circulation pump 321 to the nozzle 338. In some embodiments,periodically (e.g., when the amount of coating solution in the receivingcontainer 336 is low) coating solution from the supply vat 325 can alsobe pumped into the nozzle 338 via pump 329. In further embodiments, aplurality of nozzles can be provided at various angles and positionswith respect to the pathway of the elongated conductive body, so as tospray the elongated conductive body with jets of coating solution frommultiple positions and angles (e.g., from an angle that directs coatingsolution at the underside of the elongated conductive body).

While the transport mechanisms illustrated in FIGS. 3A-3E involve areel-to-reel system for moving a long, continuous strand of elongatedconductive body 310 for coating, in other embodiments, the elongatedconductive body being coated may be in the form of individual pieces310′, e.g., pieces formed after a singulation process whereby a long,continuous strand of elongated conductive body 310 is cut intoindividual pieces 310′. FIG. 3F illustrates one embodiment of atransport mechanism that can be used to move elongated conductive bodies310′ that are in the form of individual pieces. In the embodiment shownin FIG. 3F, the transport system 300 includes a conveyor that supports aplurality of robotic units 380. Each robotic unit 380 comprises aretractable arm 386 secured to the conveyor 384. The retractable arm 386comprises an elongated conductive body holder 388 that supports theelongated conductive body 310′. Although in the embodiment illustratedin FIG. 3F, the elongated conductive body holder 388 is shown holdingfour elongated conductive bodies 310′, in alternative embodiments, anelongated conductive body holder capable of holding any other number ofelongated conductive bodies 110′ may be used instead. As the retractablearm 386 is extended, the elongated conductive body 310′ is moveddownwards, and the elongated conductive body 310′ is partially or whollysubmerged in a coating solution. After a predetermined time, theretractable arm is retracted, and the elongated conductive body 310′ ispulled out of the coating solution. The elongated conductive body 310′is then allowed to dry as the solvent of the coating solutionevaporates. Although not shown, a heater or dryer may be disposed alongthe path of the conveyor or on the robotic unit to accelerateevaporation of the coating solution.

As shown in FIG. 3F, the conveyor 384 is designed to advance theelongated conductive body 310′ from one coating vessel 392 to anothercoating vessel 394, and then to another coating vessel 396.Additionally, the conveyor 384 is designed to advance the elongatedconductive body 310′ from one station 340 to a coating station 350, andthen to another station 360. Although with the transport system 300shown in FIG. 3F, the conveyor 384 is shown moving the elongatedconductive body 310′ between three stations (including the coatingstation 350) and three coating vessels, it should be understood that inother embodiments, the conveyor 384 may be configured to move elongatedconductive body 310′ between any number of coating vessels and anynumber of stations.

In certain embodiments, the step of depositing a coating material on theelongated conductive body and the step of controlling the thickness ofthe coating can be combined. For example, referring to FIG. 3G, acoating chamber 360 is shown that includes both a coating vessel 362 forholding a coating solution 364 and a die 366 (e.g., a diamond die) withan orifice 368 configured to control the coating thickness of theelongated conductive body 310 as it exits the coating chamber 360. FIG.3H is a close side view of the die 366 and illustrates a taperingmechanism of the die. The coating solution 364 may comprise a solventand a coating material, such as a conductive material (e.g., platinum,Ag/AgCl, etc.), an insulating material (e.g., polyurethane, polyimide,polyethylene), or a membrane material (e.g., a material used to form theelectrode layer, enzyme layer, diffusion resistance layer, interferencelayer, etc.) FIG. 3I provides a view of the coating chamber 360 on lines3I-3I of FIG. 3G. It has been found that the tapering mechanismillustrated in FIG. 3H facilitates a certain fluid dynamic that keepsthe elongated conductive body centered along the longitudinal axis ofthe die orifice 368. FIG. 3J illustrates various other non-limitingexamples of cross-sectional shapes of the die orifice 368 that can beused to mold the elongated conductive body to a desired shape. It shouldbe understood that the die 366 can not only be used to coat an elongatedconductive body formed of a single core or an elongated conductive bodyformed of a plurality of cores, but that it can also simultaneously coata plurality of elongated conductive bodies in parallel.

The entrance passage of the coating chamber 360 includes an opening 370that permits the elongated conductive body 310 to pass therethrough. Asealing member 342 is used to prevent the coating solution from leakingout of the opening 370. The sealing member 342 may be any of a varietyof seals capable of preventing or reducing liquid leakage. Seals thatcan be used include, for example, o-rings, hydraulic seals, polypakseals, quad rings, radial shaft seals, v-ring seals, and the like. Thecoating chamber 360 may include an opening 352 for introduction of thecoating solution into the coating vessel 362. Although the coatingsolution is shown in FIG. 3G as being introduced from the top of thecoating vessel 362, it should be understood that in other embodimentsthe coating solution may be introduced into coating vessel from otherentry points (e.g., from the side or bottom of the coating vessel) andby using various other mechanisms (e.g., via a conduit connected to apump and a storage tank). The coating chamber 360 may also include alevel indicator 344 that communicates with a control system, so that apredetermined level of coating solution 364 in the coating chamber 360is maintained.

In some embodiments, the system is capable of depositing a coating layerhaving a substantially uniform thickness along the outer surface 430 ofthe elongated conductive body, wherein the thickness is less than about35 microns, or less than about 25 microns, or less than about 10 micron,or less than about 5 microns, or less than about 1 microns, or even lessthan 0.1 microns. In some embodiments, the thickness uniformity of theouter diameter is better than about ±50% of the average thickness, orbetter than about ±30%, or better than about ±10%, or better than about±5%, or even better than about ±1%. In some embodiments, the coefficientof variation of the outer diameter thickness is less than about 0.2, orless than about 0.1, or less than about 0.07, or less than about 0.05,or less than about 0.02, or even less than about 0.01.

In addition to being capable of depositing a coating layer having asubstantially uniform thickness along the outer surface of the elongatedconductive body, the system is also capable of depositing a coatinglayer with a thickness profile that is substantially uniform among theplurality of window regions 420 of the elongated conductive body. Morespecifically, in some embodiments, the coating layer deposited onto eachwindow region can have a thickness profile that is consistent with thoseof the other window regions of the elongated conductive body.

To determine thickness profile uniformity, the mean coating thickness ofeach window region can be measured and compared with those of the otherwindow regions. In some embodiments, wherein the elongated conductivebody comprises 10 or more window regions, the coefficient of variation(of the 10 or more window regions) of the mean coating thickness is lessthan about 0.5, or less than about 0.2, or less than about 0.1, or lessthan about 0.05, or even less than about 0.01.

Thickness profile uniformity may also be determined by measuring coatingthickness at certain locations (e.g., at a first distance one fifth fromone end of the window region, at a second distance two fifths from oneend of the window region, etc.) inside each window region, and comparingit with other window regions. In certain embodiments, wherein theelongated conductive body comprises 10 or more window regions, thecoefficient of variation (of the 10 or more window regions) of thecoating thickness at a first distance one fifth from one end of each ofthe 10 or more window regions is less than about 0.3, or less than about0.2, or less than about 0.1, or still less than about 0.05, or even lessthan about 0.01. In certain embodiments, wherein the elongatedconductive body comprises 10 or more window regions, the coefficient ofvariation (of the 10 or more window regions) of the coating thickness ata second distance two fifths from one end of each of the 10 or morewindow regions is less than about 0.3, or less than about 0.2, or lessthan about 0.1, or still less than about 0.05, or even less than about0.01. In certain embodiments, wherein the elongated conductive bodycomprises 10 or more window regions, the coefficient of variation (ofthe 10 or more window regions) of the coating thickness at a thirddistance three fifths from one end of each of the 10 or more windowregions is less than about 0.3, or less than about 0.2, or less thanabout 0.1, or still less than about 0.05, or even less than about 0.01.In certain embodiments, wherein the elongated conductive body comprises10 or more window regions, the coefficient of variation (of the 10 ormore window regions) of the coating thickness at a fourth distancefourth fifths from one end of each of the 10 or more window regions isless than about 0.3, or less than about 0.2, or less than about 0.1, orless than about 0.05, or even less than about 0.01. In certainembodiments, wherein the elongated conductive body comprises 10 or morewindow regions, the coefficient of variation (of the 10 or more windowregions) of the coating thickness at a midpoint between two ends of eachof the 10 or more window regions is less than about 0.3, or less thanabout 0.2, or less than about 0.1, or less than about 0.05, or even lessthan about 0.01.

By providing the capability of achieving a substantially uniformthickness profile among the plurality of window regions and asubstantially uniform thickness along the outside surface of theelongated conductive body, the embodiments also provide the capabilityof achieving substantial uniformity with respect to certain sensorproperties, such as sensitivity and current density. For example, insome embodiments, wherein the elongated conductive body comprises 10 ormore window regions, the coefficient of variation (of the 10 or morewindow regions) of in vivo sensor sensitivity and/or in vitro sensorsensitivity at about 100 mg/dL glucose concentration is less than about0.5, or less than about 0.25, or less than about 0.1, or less than about0.05, or even less than about 0.01. In certain embodiments, wherein theelongated conductive body comprises 10 or more window regions, thecoefficient of variation (of the 10 or more window regions) of in vivosensor current density and/or in vitro sensor current density at about100 mg/dL glucose concentration is less than about 0.5, or less thanabout 0.25, or less than about 0.1, or less than about 0.05, or evenless than about 0.01.

Although certain thickness control mechanisms (e.g., die, a gas knife,etc.) are described elsewhere herein for controlling the thickness ofthe coating applied onto the elongated conductive body, it iscontemplated that in some embodiments these control mechanism may not benecessary. FIG. 3K illustrates one embodiment of a coating device 390comprising two absorption pads 398, 399 that are soaked with a solutioncomprising the coating material. One or more of absorption pads may bein communication with a reservoir 378 holding a solution with thecoating material. In this particular embodiment, the two absorption padsare arranged in an abutting relationship, such that as the elongatedconductive body is advanced in a path along a plane defined by theinterface between the two absorption pads. The solution with the coatingmaterial is applied to the elongated conductive body. By controlling theconcentration gradient that exists at the interface 358, the amount ofcoating that is applied to the elongated conductive body 310 can becontrolled. Other ways of controlling the thickness of the elongatedconductive body include, but are not limited to, controlling the surfaceenergy of the elongated conductive body, controlling the speed at whichthe elongated conductive body is advanced, and controlling the viscosityof the solution comprising the coating material. Accordingly, withmultiple passes through the coating device 390, an elongated conductivebody 310 with a certain preselected thickness of a coating material canbe obtained. The pads may be formed of any material, such as a fibrousmaterial, that is capable of absorbing the solution. In addition,although the embodiment illustrated in FIG. 3K includes two absorptionpads, it should be understood that in other embodiments, a differentnumber of absorption pads (e.g., three, four, five, ten, or more) havingthe same or different shapes or dimensions can also be used.

Thickness Control Station

Referring back to FIGS. 1A-1D, After advancing through the coatingstation 120, the elongated conductive body 110 is then advanced to athickness control station 130. In some embodiments, the thicknesscontrol station 130 comprises a die (not shown) mounted transverse tothe elongated conductive body. As the elongated conductive body advancesthrough an orifice of the die, excess coating material is removed toform on the treated surface a coating layer having a substantiallyconsistent thickness. As described above, the excess coating materialremoved is from the outer surface 430 of the elongated conductive body,and not from the window surface 420. The dimensions of the die orificecan vary depending on the type of coating being formed on the elongatedconductive body. With respect to the coating process involving theinsulating layer, the die orifice can have a radius of from about 0.1 toabout 25 microns larger than that of the elongated conductive bodywithout the insulating layer, or from about 5 to about 15 micronslarger, or even from about 10 to about 14 microns larger. With respectto the coating process involving the conductive layer, the die orificecan have a radius of from about 0.1 to about 25 microns larger than thatof the elongated conductive body without the conductive layer, or fromabout 1 to about 15 microns larger, or even from about 5 to about 10microns larger. With respect to the coating process involving theelectrode layer, the die orifice can have a radius from about 0.1 toabout 25 microns larger than that of the elongated conductive bodywithout the electrode layer, or from about 0.2 and 10 microns larger, oreven from about 0.5 to about 1.5 microns larger. With respect to thecoating process involving the interference layer, the die orifice canhave a radius of from about 0.1 to about 25 microns larger than that ofthe elongated conductive body without the interference layer, or fromabout 0.2 to about 10 microns larger, or even from about 0.5 to about1.5 microns larger. With respect to the coating process involving theenzyme layer, the die orifice can have a radius of from about 0.1 toabout 25 microns larger than that of the elongated conductive bodywithout the enzyme layer, or from about 0.2 to about 10 microns larger,or even from about 0.5 to about 1.5 microns larger. With respect to thecoating process involving the diffusion resistance layer, the dieorifice can have a radius of from about 0.1 to about 25 microns largerthan that of the elongated conductive body without the diffusionresistance layer, or from about 1 to about 15 microns larger, or evenfrom about 5 to about 10 microns larger.

While in some embodiments the die orifice has a circular orsubstantially circular shape, in other embodiments the die orifice canhave a shape that is oval, square, rectangular, triangular, polyhedral,star-shaped, C-shaped, T-shaped, X-shaped, Y-Shaped, irregular, or thelike.

In some embodiments, the thickness control station can comprise aplurality of dies, each or some of which comprise an orifice with ashape or dimension different from that of the other dies. For example,in one embodiment, the thickness control station can comprise three diesarranged in a series, with each die comprising a circular orifice,wherein a first die orifice comprises a larger diameter than that of asecond die, and the second die orifice comprises a larger diameter thanthat of a third die. Alternatively, in some embodiments, the thicknesscontrol station can comprise one die with a plurality of orifices formedtherein, with each orifice configured to receive an elongated conductivebody.

In one embodiment, the die can comprise a plurality of movable membersconfigured to collectively define the outline of an orifice, throughwhich the elongated conductive body is configured to advance. Themovable members can be controlled by the processor to move to differentpositions and arrangements to form orifices of different shapes anddimensions. This feature provides the system with the capability toadjust the shape and dimension of the orifice to conform to certainpreselected process parameters (e.g., preselected shape or thickness ofthe elongated conductive body). In some embodiments, to make certainthat the elongated conductive body is centered with respect to its entryinto the die orifice, guide rollers or pulleys can be disposed near theentrance and/or exit of the die, to provide precise guidance to themoving elongated conductive body.

As the process progresses, a buildup of coating material may form in theregion of the orifice. To remove this buildup, the thickness controlstation can include a solvent source that periodically or continuouslysends solvent to the orifice. In some embodiments, the thickness controlstation can comprise a pan for collecting excess coating material thatfalls from the elongated conductive body or the die. The excess coatingmaterial may be discarded or reused if suitable.

In addition to the die described above, it is contemplated that otherknown techniques for removing excess coating material can also be used.For example, in some embodiments, as an alternative or in addition tothe die, a gas knife, using impinging jets of inert gas (e.g., nitrogen)can be used.

Drying Curing Station

As shown in FIG. 1A, the system 100 comprises a drying or curing station140 for drying and curing the coating material deposited onto theelongated conductive body 110. As the elongated conductive body 110advances through the drying/curing station 140, residual solvent on thesurface of the elongated conductive body 110 is evaporated. Furthermore,crosslinkable components of the coating material can be substantiallycrosslinked. The curing process can be carried out by any of a varietyof conventional drying techniques, such as by UV, infrared, microwave,x-ray, gamma ray, or electron beam radiation, whereby radiation isdirected at the coating material, or alternatively by heat, such as byconduction drying or convection drying, for example, by hot airconvection drying using a hot air convection oven. Depending in part onthe particular coating material used and the coating thickness, one ormore of the above-mentioned techniques may be used as an alternative (orin addition) to other techniques. For example, while not wishing to bebound by theory, it is believed that a high energy radiation curingmechanism (e.g., short wavelength UV) may sometimes be used when thedeposited layer is thick, because high energy radiation typicallypenetrates coating material better than infrared light, and thus mayprovide more curing uniformity along the entire thickness of the coatedmaterial. Radiation-based curing may also be used in some embodimentsbecause it provides tight control over the level of radiation, therebyallowing for better control of the curing process. The curing processmay take place under a variety of process conditions. In one embodiment,the drying or curing process occurs in a curing chamber and/or oven at atemperature of from about 20° C. to about 500° C., or from about 50° C.to about 150° C., or even from about 200° C. to about 400° C. In someembodiments, the system can include a humidifier/dehumidifier formaintaining proper relative humidity in the drying/curing station.

Thickness Measurement Station

Referring back to the embodiment illustrated in FIG. 1A, the system 100includes a thickness measurement station 150 comprising a thicknessmeasurement sensor or micrometer configured for measuring the thicknessof the elongated conductive body 110 (with or without coating), as itpasses through the thickness measurement station 150. After obtaining areading, the micrometer is configured to transmit to the processor 160 asignal indicative of the measured thickness. If the measured thicknessis determined to be less than the preselected thickness, the system isconfigured to repeat the coating process until a layer having thepreselected thickness is formed.

It is contemplated that the thickness measurement sensor or micrometercan be any of a variety of devices capable of measuring a dimensionindicative of a thickness of a coating formed on the elongatedconductive body. For example, in some embodiments, the micrometer can bean optical micrometer, but in other embodiments the micrometer can be agauge device or other similar device configured to contact the elongatedconductive body for thickness measurement. Optical micrometers that canbe used include light emitting diode (LED) devices, laser devices, orother similar devices capable of measuring certain elongated bodies(e.g., wires and webs) at suitable sampling rates. Typically, with anoptical micrometer, the micrometer itself is positioned near the pathwayof the elongated conductive body and configured to measure the thicknessof the elongated conductive body without actually contacting it.

In some embodiments, the thickness measurement sensor is configured toperiodically measure the outside diameter of the elongated conductivebody. The thickness measurement sensor can also be operatively connectedto the processor, which is programmed to compare the latest measurementvalue of the diameter with a prior measurement value corresponding tothe diameter prior to the latest coating sequence. The processor mayalso be programmed to calculate the thickness of the latest coating bysubtracting the prior measurement value from the latest measurementvalue. The thickness of the coated elongated conductive body will ofcourse progressively increase with each successive layer of coatingmaterial deposited onto the elongated conductive body. Once adetermination has been made as to the layer thickness of a certainsegment of the elongated conductive body, the processor is programmed toinstruct the thickness measurement sensor to measure another segment ofthe elongated conductive body as it advances into the thicknessmeasurement sensor. In some embodiments, the thickness measurementsensor may be set to make a thickness measurement about every 100 cm ofthe elongated conductive body, or less than about every 50 cm, or lessthan about every 25 cm, or still less than about every 10 cm, or lessthan about every 5 cm, or less than about every 2.5 cm, or less thanabout every 1 cm, or less than about every 1 mm, or even less than aboutevery 100 microns. The measurements made by the thickness measurementsensor can be for the outer surface of the elongated conductive body,the window surface, or both. Based upon the signal transmitted from thethickness measurement sensor, the processor 160 may control certainparameters of the coating process. For example, if a particular coatingthickness (e.g., thickness of the electrode layer, enzyme layer, and/ordiffusion resistance layer) is measured to be less than the preselectedthickness, the system may be programmed to repeat the coating processonce, twice, or more times, until the preselected thickness has beenachieved.

Alternatively, in other embodiments, the system may be programmed to runthe coating process for a preselected number of iterations, instead ofprogrammed to run the coating process repeatedly until a certainpreselected thickness is achieved. In these embodiments, thicknesscontrol can still be achieved because of the high level of precision ofthickness control provided by the system.

In some embodiments, the thickness measurement station 150 may not beconfigured to measure the exact thickness of the elongated conductivebody. Instead, the thickness measurement station may include a visionsystem that is configured to detect certain surface irregularities onthe elongated conductive body. Irregularities can include, but are notlimited to, exposed patches that resemble an undercoating (e.g., aninsulating coating underlying a conductive coating) and that indicate asection of the elongated conductive body in which coating is very thinor nonexistent. The exposed patches can show up on the vision systemwith a color or reflection that is different than that expected. After asurface irregularity has been detected, the coating process can bestopped. Alternatively, the process can be continued, with the sectionof the detected surface irregularity recorded, and the recorded sectioncan be removed in subsequent processing.

Post-Coating Treatment Station

After the elongated conductive body has been coated with at least onelayer of material, such as a conductive material, insulating material,or membrane material (e.g., materials that form the electrode,interference, enzyme, and/or diffusion resistance layers), with eachlayer having been determined as having the preselected thickness, theelongated conductive body can then be advanced to a post-coatingtreatment station, where the elongated conductive body is cleaned andfurther processed, for example, through an another surface treatmentprocess (e.g., plasma treatment). In some embodiments, after singulationof the elongated conductive body into individual sensors, the ends ortips of the singulated individual sensors may have various exposed metalportions not covered by a membrane or an insulating layer. A sensorformed without a seal covering these end portions may pick up variouslevels of unwanted signals. Thus, in some embodiments, the exposedportions are sealed off using any of a variety of known techniques, suchas, for example, by dipping, spraying, shrink tubing, or crimp wrappingan insulating, membrane, or other isolating material onto the sensortip. In certain embodiments, in which the sensor tip is capped with amembrane material, the tip can serve as a working electrode. After theend sealing process, certain portions (e.g., the back ends) of thesingulated sensors can be etched to expose a conductive material, toprovide the sensors with electrical connection. Alternatively oradditionally, a mechanical connector may be clamped onto the elongatedconductive body's conductive surface, cutting through the membrane inthe process. Thereafter, the sensors can be delivered to other stationsfor further processing.

After the continuous analyte sensors have been completely built, thesensors are then packaged into containers or boxes for shipping to apatient, hospital, or retailer. The containers or boxes may be formed ofspecial materials that are capable of protecting the sensors from harshenvironmental conditions.

Singulation Station

During any time of the sensor manufacturing process, the elongatedconductive body can be cut for singulation into individual pieces. Forexample, in some embodiments, singulation can be performed beforecoating of conductive and/or insulating materials. In other embodiments,singulation can be performed after coating of the conductive and/orinsulating materials, but before coating of membrane materials. In yetother embodiments, singulation can be performed after coating ofconductive and/or insulating materials and after coating of membranematerials. Any of a variety of known cutting systems, such as a systemcomprising a hydraulic cutting device, for example, can be used.

FIG. 11 illustrates one embodiment of a system 1100 that integratesetching (to remove or strip portions of a coated assembly structure) andsingulation of the elongated conductive body into individual pieces. Inthis embodiment, the cutting system 1100 includes a supply spool 1120which feeds an elongated conductive body 1110 into an elongatedconductive body straightener 1130 (e.g., a wire straightener). Theelongated conductive body 1110 is then fed into a rotating mandrel 1140,which rotates the elongated conductive body 1110. Periodically, anelongated conductive body gripping device 1150 moves forward and graspsthe end of the elongated conductive body 1110 and then moves backwardsto position the elongated conductive body 1110 for etching by any of theetching processes described elsewhere herein (e.g., by laser ablation1190). Rotation of the elongated conductive body 1110 can involve acomplete rotation (i.e., a rotation of 360 degrees or more), throughwhich a portion associated with the entire circumference of theelongated conductive body 1110 is etched. Alternatively, rotation of theelongated conductive body can be partial and controlled such that onlycertain sections associated with the elongated conduct body'scircumference is etched. After the etching process is completed, asection of the elongated conductive body 1110 is cut by a cutter 1160.The steps described are then continuously repeated. It should beunderstood that the system described above is merely exemplary, and somecomponents (e.g., the mandrel 1140 or the etching mechanism) may beomitted or replaced by other components (e.g., a drying or curingmechanism).

Sensor Manufacturing Process

FIG. 5 is a flowchart summarizing the steps of one embodiment of amethod for continuously manufacturing analyte sensors. In step 510, anelongated conductive body is provided. The elongated conductive body canbe a bare elongated core (e.g., a metal wire), a cladded elongated core,or a bare or cladded elongated core coated with one, two, three, four,five, or more layers of material. Although not shown in FIG. 5, in someembodiments, step 510 can be preceded by one or more steps, wherein theabove-described elongated conductive body (as shown in FIG. 4A) is builtby coating an elongated core (e.g., a wire) with one or more layers ofmaterial (e.g., an insulating layer and a conductive layer) to form acoated assembly structure, and then removing portions of the coatedassembly structure. For example, in one embodiment, the elongated coreis advanced through a coating station/thickness controlstation/drying/curing station/thickness measurement stationseries/sequence, whereby it is coated with an insulating material. Theseries/sequence may be repeated until an insulating layer having apreselected thickness has been deposited, as measured by the thicknessmeasurement sensor. The elongated conductive body is then advancedthrough a coating station/thickness control station/drying/curingstation/thickness measurement station sequence, whereby it is coatedwith a conductive material. Again, the sequence may be repeated until aconductive layer having a preselected thickness has been deposited.After the insulating and conductive layers have been deposited onto theelongated core, the elongated conductive body can then be advanced to anetching station, where portions of the coated assembly structure isstripped or otherwise removed (e.g., to expose the electroactivesurfaces of the elongated core, thereby creating window regionscorresponding to electroactive surface areas).

In step 520, the elongated conductive body is advanced through apre-coating treatment station, where it is cleaned with a solvent toremove surface contaminants. In some embodiments, an additional dryingstep can be provided to evaporate any residual solvents left on thesurface of the elongated conductive body.

In step 530, the elongated conductive body is advanced through a coatingstation, where a coating solution comprising a solvent and a coatingmaterial (e.g., a material to form a conductive layer, insulating layer,or a membrane) is deposited onto the elongated conductive body. Thelayers that may form the membrane system are described in greater detailbelow. As the solvent portion of the coating solution evaporates, asolid layer of the coating material is formed on the elongatedconductive body. In some embodiments, the coating solution is depositedby a meniscus coating process, whereby the elongated conductive body isadvanced through a meniscus established at an opening of a coatingvessel. The meniscus coating process described herein provides thesystem with the capability of precisely controlling the thickness andthickness profile of the coating deposited.

In step 540, the elongated conductive body is advanced through athickness control station, where excess coating material can be removedto form on the treated surface a layer of coating having a substantiallyconsistent thickness. In some embodiments, the coating station and thethickness control station may be integrated into one station.

In step 550, the elongated conductive body is advanced through thedrying or curing station, where it may be dried under ambient conditionsor heated to remove residual solvent on the surface of the elongatedconductive body. In certain embodiments, at the drying or curingstation, crosslinkable components of the coating material aresubstantially crosslinked. The curing process can be carried out by anyof a variety of conventional drying techniques including, but notlimited to, by UV, infrared, microwave, x-ray, gamma ray, or electronbeam radiation, or by heat.

In step 560, the elongated conductive body is advanced through thethickness measurement station, where a measurement is made of thethickness of the elongated conductive body, and a signal indicative ofthe measurement is transmitted to the processor. The processor thencompares the measured thickness with a preselected thickness. If themeasured thickness is determined to be less than the preselectedthickness, the system is programmed to repeat the coating process untila layer having the preselected thickness is formed.

In step 570, after being coated with multiple layers of material (e.g.,insulating, conductive, electrode, interference, enzyme, and/ordiffusion resistance material), with each layer having the preselectedthickness, the elongated conductive body is advanced into thepost-coating treatment station, where it can be cleaned and/or undergofurther treatment. Thereafter, the individual sensors can be deliveredto other stations for further processing.

It should be understood that the method described above is merelyexemplary, and some steps may be omitted or replaced by other steps.Furthermore, although the steps of the method are described in aparticular order, the various steps need not be performed sequentiallyor in the order described. For example, in some embodiments, anelongated conductive body is provided, as indicated by step 510.Thereafter, it undergoes processing, as indicated by steps 520, 530,540, 550, and 560, whereby a coating forming a first layer (e.g., aninsulating layer) with a preselected thickness is deposited on theelongated conductive body. The coating process (i.e., the sequenceformed of steps 520, 530, 540, 550, and 560) can be repeated severaltimes, with each passing sequence resulting in a successive layer (e.g.,a second layer comprising an enzyme layer, a third layer comprising adiffusion resistance layer, etc.) with a preselected thickness beingdeposited onto the elongated conductive body. After the preselectedlayers have been deposited, the elongated conductive body can then betransferred to a station for post-coating treatment, as indicated bystep 570.

To demonstrate the method described in FIG. 5, an example is providedherein describing one embodiment of coating polyurethane (an insulatingmaterial) onto the outer conductive surface of an elongated conductivebody. Although the material described in this example is polyurethane,it should be understood that other insulating materials (e.g.,polyethylene, polyimide, etc.) may be also be used in accordance withthe method described herein.

In step 510, an elongated conductive body is provided which has an outerconductive layer formed of platinum and an inner core formed of anothermaterial (e.g., stainless steel, titanium, tantalum, glass, polymericmaterial, non-conductive material, etc.). In an alternative embodiment,the entire elongated conductive body may be monolithic and formed of aconductive material, such as platinum, platinum-iridium, gold,palladium, iridium, graphite, carbon, conductive polymers, andcombinations thereof.

Next, in step 520 the elongated conductive body is treated (e.g., washedwith alcohol or treated with plasma). In some embodiments, an adhesionpromoter may be applied to the outer surface of the elongated conductivebody. The adhesion promoter may be used to cause surface reaction toimprove adhesion of the polyurethane to the conductive surface of theelongated conductive body, and thereby reduce the risk of delamination.The adhesion promoters, in a non-limiting embodiment, can be monomers,oligomers and/or polymers. Such materials include, but are not limitedto, organometallics such as silanes, (e.g., mercapto silanes, acrylateor methacrylate functional silanes, vinyl silanes, amino silanes, epoxysilanes, isocyanate silanes, fluoro silanes, and alkyl silanes),siloxanes, titanates, zirconates, aluminates, metal containingcompounds, zirconium aluminates, hydrolysates thereof and mixturesthereof. In one embodiment, silane is used as an adhesion promoter, andit is used as a component of a solution. In a further embodiment, thesolution comprises from about 90% to 98% organic solvent (e.g., ethanol,tetrahydrofuran), about 1% to 5% water, and about 1 to 5% silane ontothe outer surface of the elongated conductive body. The solvents maythen be removed by air drying and/or by using an oven.

Thereafter, in step 530, the polyurethane is coated onto the elongatedconductive body using any of the coating techniques described elsewhereherein, such as a meniscus coating method. The polyurethane coating isthen dried or cured. In certain embodiments, the polyurethane may have athickness of from about 5 microns to about 50 microns, or from about 12microns to about 25 microns, or even from about 18 microns to about 23microns. Excess coating materials of polyurethane are then removed byuse of a die, in accordance with step 540. The cycle from step 510 tostep 550 can then be repeated until a preselected thickness of thepolyurethane layer has been achieved.

To further demonstrate the method described in FIG. 5, another exampleis provided herein. This particular example describes one embodiment ofcoating a platinum material onto the elongated core or an Ag/AgClmaterial (i.e., a conductive material) onto the polyurethane layerdescribed in the example above. Although the materials used in thisexample are platinum, Ag/AgCl, and polyurethane, it should be understoodthat other conductive materials and insulating materials may also beused in accordance with the method described herein.

With respect to coating of Ag/AgCl onto the polyurethane, the coatingmaterial can involve an Ag/AgCl solution or paste which can be purchasedfrom commercially available sources or alternatively prepared to havecertain specified properties. Typically, an AgCl layer is consumedduring a period when the Ag/AgCl electrode is used as a cathode.Accordingly, by controlling the composition, thickness, or otherproperties of the Ag/AgCl layer, the effective lifespan of a sensor(i.e., the period of time that it can function properly) can becontrolled by the manufacturing method. The silver grain and the silverchloride grain can have any of a variety of shapes, such as a shapesimilar to a sphere, plate, flake, a polyhedron, or combinationsthereof.

In some embodiments, the silver grain in the Ag/AgCl solution or pastecan have an average particle size associated with a maximum particledimension that is less than about 100 microns, or less than about 50microns, or less than about 30 microns, or less than about 20 microns,or less than about 10 microns, or even less than about 5 microns. Thesilver chloride grain in the Ag/AgCl solution or paste can have anaverage particle size associated with a maximum particle dimension thatis less than about 100 microns, or less than about 80 microns, or lessthan about 60 microns, or less than about 50 microns, or less than about20 microns, or even less than about 10 microns. The silver grain and thesilver chloride grain may be incorporated at a ratio of the silverchloride grain:silver grain of from about 0.01:1 to 2:1 by weight, andsometimes from about 0.1:1 to 1:1. The silver grains and the silverchloride grains are then mixed with a carrier (e.g., a polyurethane) toform a solution or paste. In certain embodiments, the Ag/AgCl componentcomprises from about 10% to about 65% by weight of the total Ag/AgClsolution or paste, or from about 20% to about 50% by weight of the totalAg/AgCl solution or paste, or even from about 23% to about 37% by weightof the total Ag/AgCl solution or paste. In some embodiments, the Ag/AgClsolution or paste has a viscosity (under ambient conditions) that isfrom about 1 to about 500 centipoise, or from about 10 to about 300centipoise, or even from about 50 to about 150 centipoise.

Prior to the coating step 530, an elongated conductive body is providedin step 510. In one embodiment associated with coating of platinum ontothe elongated core, the elongated conductive body is only an elongatedcore. In one embodiment associated with coating of Ag/AgCl ontopolyurethane, the elongated conductive body has an outer conductivelayer formed of platinum with an inner elongated core formed of anothermaterial (e.g., stainless steel, titanium, tantalum, polymeric material,non-conductive material, etc.). Disposed over the platinum layer is alayer of polyurethane deposited using the method described in theexample above. In alternative embodiments, the entire elongatedconductive body may be monolithic and formed of a conductive material,such as platinum, platinum-iridium, gold, palladium, iridium, graphite,carbon, conductive polymers, and combinations thereof.

Next, in step 520 the elongated conductive body is treated (e.g., washedwith an alcohol wash, treated with plasma, or corona treatment). Similarto the example described above regarding the coating of polyurethane, anadhesion promoter may optionally be applied to the polyurethane toimprove the adhesion of the polyurethane to the Ag/AgCl material beingdeposited or of the elongated core material (e.g., stainless steel,tantalum) to the platinum material being deposited.

Thereafter, in step 530, the platinum solution or Ag/AgCl solution orpaste is coated onto the elongated conductive body using any of thecoating techniques described elsewhere herein. In one embodiment, thecoating chamber 360 illustrated in FIG. 3G is used to perform thecoating step 530. In addition, the die 366 in the coating chamber isused to perform the step 540 of removing excess platinum, Ag/AgCl, orother material from the elongated conductive body. In one embodimentassociated with coating of platinum onto the elongated core, the coatedplatinum layer may have a thickness of from a thickness corresponding toa layer formed from a few platinum atoms to about 200 microns, or fromabout 1 micron to about 10 microns, or even from about 3 microns toabout 5 microns. In one embodiment associated with the coating ofAg/AgCl onto the elongated core, the coated Ag/AgCl layer can have athickness of from about 0.5 microns to about 30 microns, or from about 1micron to about 20 microns, or even from about 5 microns to about 15microns. The cycle from step 510 to step 550 is then be repeated until apreselected thickness of the platinum layer or Ag/AgCl layer has beenachieved. It is contemplated that the ratio of the thickness of theAg/AgCl layer to the thickness of the polyurethane layer can becontrolled, so as to allow for a certain error margin (e.g., an errormargin associated with the etching process) that would not result in adefective sensor (e.g., due to a defect resulting from an etchingprocess that cuts into a depth more than intended, therebyunintentionally exposing an electroactive surface). This ratio may bedifferent depending on the type of etching process used, e.g., whetherit is laser ablation, grit blasting, chemical etching, or some otheretching method. For laser ablation, the ratio of the thickness of theAg/AgCl layer to the thickness of the polyurethane layer can be fromabout 1:5 to about 1:1, or from about 1:3 to about 1:2.

Membrane System

The membrane systems described herein can be formed using the systemsand methods described above, and are suitable for use with implantablesensors in contact with a biological fluid. For example, the membranesystem can be utilized with sensors for measuring analyte levels in abiological fluid, such as sensors for monitoring glucose levels forindividuals having diabetes. In some embodiments, the analyte-measuringsensor is a continuous sensor. A wide variety of sensor configurationsare contemplated with respect to sensor placement. For example, in someembodiments, the sensor can be configured for transdermal (e.g.,transcutaneous) placement, but in other embodiments the sensor can beconfigured for intravascular placement, subcutaneous placement,intramuscular placement, or intraosseous placement. The sensor can useany method to provide an output signal indicative of the concentrationof the analyte of interest; these methods can include, for example,invasive, minimally invasive, or non-invasive sensing techniques.

Although some of the description that follows is directed atglucose-measuring devices, the membrane systems described herein are notlimited to use in devices that measure or monitor glucose. Rather, thesemembrane systems are suitable for use in any of a variety of devices,including, for example, devices that detect and quantify other analytespresent in biological fluids (e.g., cholesterol, amino acids, alcohol,galactose, and lactate), cell transplantation devices, drug deliverydevices, and the like.

FIG. 6A is a cross-sectional view through one embodiment of theelongated conductive body of FIG. 4B on line 6A-6A, illustrating oneembodiment of the membrane system 600. The cross-section illustrated inFIG. 6A corresponds to the window surface of the elongated conductivebody. As described above, the window surface can correspond to a workingelectrode formed in part, for example, by removing a portion of theinsulating material and conductive material from an electroactivesurface the elongated conductive body by ablation, etching, or otherlike techniques. FIG. 6B is a cross-sectional view through the elongatedconductive body of FIG. 4B on line 6B-6B.

In the particular embodiment shown in FIGS. 6A and 6B, the membranesystem 600 comprises an electrode layer 620, interference layer 630,enzyme layer 640, and a diffusion resistance layer 650, located aroundthe core 610 of the elongated conductive body. It should be understoodthat any of the layers described herein, e.g., the electrode,interference, enzyme, or diffusion resistance layer, may be omitted. Inaddition, it should be understood the membrane system can have any of avariety of layer arrangements, with some arrangements having more orless layers than other arrangements. For example, in some embodiments,the membrane system can comprise one interference layer, one enzymelayer, and two diffusion resistance layers, but in other embodiments,the membrane system can comprise one electrode layer, one enzyme layer,and one diffusion resistance layer. Additionally, it should beunderstood that although the exemplary embodiments illustrated in FIGS.6A and 6B involve circumferentially extending membrane systems coveringan elongated conductive body with a circular cross-section, themembranes described herein can be applied to any planar or non-planarsurface and an elongated conductive body with any variety ofcross-sectional shapes, such as oval, square, rectangular, triangular,polyhedral, star-shaped, C-shaped, T-shaped, X-shaped, Y-Shaped,irregular, or the like, for example. As shown, the portion of theelongated conductive body corresponding to the section illustrated inFIG. 6B comprises an additional conductive layer 670 and an insulatinglayer 660 that separates the core 610 from the conductive layer 670.

In some embodiments, one or more layers of the membrane system can beformed from materials such as silicone, polytetrafluoroethylene,polyethylene-co-tetrafluoroethylene, polyolefin, polyester,polycarbonate, biostable polytetrafluoroethylene, homopolymers,copolymers, terpolymers of polyurethanes, polypropylene (PP),polyvinylchloride (PVC), polyvinylidene fluoride (PVDF), polybutyleneterephthalate (PBT), polymethylmethacrylate (PMMA), polyether etherketone (PEEK), polyamides, polyimides, polystyrenes, polyurethanes,cellulosic polymers, poly(ethylene oxide), poly(propylene oxide) andcopolymers and blends thereof, polysulfones and block copolymers thereofincluding, for example, di-block, tri-block, alternating, random andgraft copolymers.

In some embodiments, one or more layers of the membrane system areformed from a silicone polymer. In further embodiments, the siliconecomposition can have molecular weight of from about 50,000 to about800,000 g/mol. It has been found that having the polymers formed withthis molecular weight range facilitates the preparation of cross-linkedmembranes that provide the strength, tear resistance, stability, andtoughness advantageous for use in vivo.

In some embodiments, the silicone polymer is a liquid silicone rubberthat may be vulcanized using a metal- (e.g., platinum), peroxide-,heat-, ultraviolet-, or other radiation-catalyzed process. In someembodiments, the silicone polymer is a dimethyl- andmethylhydrogensiloxane copolymer. In some embodiments, the copolymer hasvinyl substituents. In some embodiments, commercially available siliconepolymers can be used. For example, commercially available siliconepolymer precursor compositions can be used to prepare the blends, suchas described below. In one embodiment, MED-4840 available from NUSIL®Technology LLC is used as a precursor to the silicone polymer used inthe blend. MED-4840 consists of a 2-part silicone elastomer precursorincluding vinyl-functionalized dimethyl- and methylhydrogensiloxanecopolymers, amorphous silica, a platinum catalyst, a crosslinker, and aninhibitor. The two components can be mixed together and heated toinitiate vulcanization, thereby forming an elastomeric solid material.Other suitable silicone polymer precursor systems include, but are notlimited to, MED-2174 peroxide-cured liquid silicone rubber availablefrom NUSIL® Technology LLC, SILASTIC® MDX4-4210 platinum-curedbiomedical grade elastomer available from DOW CORNING®, and ImplantGrade Liquid Silicone Polymer (durometers 10-50) available from AppliedSilicone Corporation.

In some embodiments, one or more layer of the membrane system is formedfrom a blend of a silicone polymer and a hydrophilic polymer. By“hydrophilic polymer,” it is meant that the polymer has a substantiallyhydrophilic domain in which aqueous substances can easily dissolve. Ithas been found that use of such a blend may provide high oxygensolubility and allow for the transport of glucose or other suchwater-soluble molecules (for example, drugs) through the membrane. Inone embodiment, the hydrophilic polymer comprises both a hydrophilicdomain and a partially hydrophobic domain (e.g., a copolymer), wherebythe partially hydrophobic domain facilitates the blending of thehydrophilic polymer with the hydrophobic silicone polymer. In oneembodiment, the hydrophobic domain is itself a polymer (i.e., apolymeric hydrophobic domain). For example, in one embodiment, thehydrophobic domain is not a simple molecular head group but is ratherpolymeric.

The silicone polymer for use in the silicone/hydrophilic polymer blendcan be any suitable silicone polymer, include those described above. Thehydrophilic polymer for use in the silicone/hydrophilic polymer blendcan be any suitable hydrophilic polymer, including but not limited tocomponents such as polyvinylpyrrolidone (PVP), polyhydroxyethylmethacrylate, polyvinylalcohol, polyacrylic acid, polyethers such aspolyethylene glycol or polypropylene oxide, and copolymers thereof,including, for example, di-block, tri-block, alternating, random, comb,star, dendritic, and graft copolymers (block copolymers are discussed inU.S. Pat. No. 4,803,243 and U.S. Pat. No. 4,686,044). In one embodiment,the hydrophilic polymer is a copolymer of poly(ethylene oxide) (PEO) andpoly(propylene oxide) (PPO), such as PEO-PPO diblock copolymers,PPO-PEO-PPO triblock copolymers, PEO-PPO-PEO triblock copolymers,alternating block copolymers of PEO-PPO, random copolymers of ethyleneoxide and propylene oxide, and blends thereof, for example. In someembodiments, the copolymers can be optionally substituted with hydroxysubstituents. Commercially available examples of PEO and PPO copolymersinclude the PLURONIC® brand of polymers available from BASF®. SomePLURONIC® polymers are triblock copolymers of poly(ethyleneoxide)-poly(propylene oxide)-poly(ethylene oxide) having the generalmolecular structure:

HO—(CH₂CH₂O)_(x)—(CH₂CH₂CH₂O)_(y)—(CH₂CH₂O)_(x)—OH

wherein the repeat units x and y vary among various PLURONIC® products.The poly(ethylene oxide) blocks act as a hydrophilic domain allowing thedissolution of aqueous agents in the polymer. The poly(propylene oxide)block acts as a hydrophobic domain facilitating the blending of thePLURONIC® polymer with a silicone polymer. In one embodiment, PLURONIC®F-127 is used having x of approximately 100 and y of approximately 65.The molecular weight of PLURONIC® F-127 is approximately 12,600 g/mol asreported by the manufacture. Other PLURONIC® polymers includePPO-PEO-PPO triblock copolymers (e.g., PLURONIC® R products). Othersuitable commercial polymers include, but are not limited to,SYNPERONICS® products available from UNIQEMA®.

The membrane system of some embodiments can comprise at least onepolymer containing a surface-active group. The term “surface-activegroup” and “surface-active end group” as used herein are broad terms andare used in their ordinary sense, including, without limitation,surface-active oligomers or other surface-active moieties havingsurface-active properties, such as alkyl groups, which are inclined tomigrate towards a surface of a membrane formed thereof. In someembodiments, the surface-active group-containing polymer is asurface-active end group-containing polymer. In some of theseembodiments, the surface-active end group-containing polymer is apolymer having covalently bonded surface-active end groups. However, itis contemplated that other surface-active group-containing polymers mayalso be used and can be formed by modification of fully-reacted basepolymers via the grafting of side chain structures, surface treatmentsor coatings applied after membrane fabrication (e.g., viasurface-modifying additives), blending of a surface-modifying additiveto a base polymer before membrane fabrication, immobilization of thesurface-active-group-containing soft segments by physical entrainmentduring synthesis, or the like.

Base polymers useful for certain embodiments can include any linear orbranched polymer on the backbone structure of the polymer. Suitable basepolymers can include, but are not limited to, epoxies, polyolefins,polysiloxanes, polyethers, acrylics, polyesters, carbonates, andpolyurethanes, wherein polyurethanes can include polyurethane copolymerssuch as polyether-urethane-urea, polycarbonate-urethane,polyether-urethane, silicone-polyether-urethane,silicone-polycarbonate-urethane, polyester-urethane, and the like. Insome embodiments, base polymers can be selected for their bulkproperties, such as, but not limited to, tensile strength, flex life,modulus, and the like. For example, polyurethanes are known to berelatively strong and to provide numerous reactive pathways, whichproperties may be advantageous as bulk properties for a membrane layerof the continuous sensor.

In some embodiments, a base polymer synthesized to have hydrophilicsegments can be used to form at least a portion of the membrane system.For example, a linear base polymer including biocompatible segmentedblock polyurethane copolymers comprising hard and soft segments can beused. It is contemplated that polyisocyanates can be used for thepreparation of the hard segments of the copolymer and may be aromatic oraliphatic diisocyanates. The soft segments used in the preparation ofthe polyurethane can be derived from a polyfunctional aliphatic polyol,a polyfunctional aliphatic or aromatic amine, or the like that can beuseful for creating permeability of the analyte (e.g., glucose)therethrough, and can include, for example, polyvinyl acetate (PVA),poly(ethylene glycol) (PEG), polyacrylamide, acetates, polyethyleneoxide (PEO), polyethylacrylate (PEA), polyvinylpyrrolidone (PVP), andvariations thereof (e.g., PVP vinyl acetate).

Alternatively, in some embodiments, the membrane system can comprise acombination of a base polymer (e.g., polyurethane) and one or morehydrophilic polymers, such as, PVA, PEG, polyacrylamide, acetates, PEO,PEA, PVP, and variations thereof (e.g., PVP vinyl acetate), as aphysical blend or admixture, wherein each polymer maintains its uniquechemical nature. It is contemplated that any of a variety of combinationof polymers can be used to yield a blend with desired glucose, oxygen,and interference permeability properties. For example, in someembodiments, the membrane can comprise a blend of apolycarbonate-urethane base polymer and PVP, but in other embodiments, ablend of a polyurethane, or another base polymer, and one or morehydrophilic polymers can be used instead. In some of the embodimentsinvolving use of PVP, the PVP portion of the polymer blend can comprisefrom about 5% to about 50% by weight of the polymer blend, or from about15% to 20%, or even from about 25% to 40%. It is contemplated that PVPof various molecular weights may be used. For example, in someembodiments, the molecular weight of the PVP used can be from about25,000 daltons to about 5,000,000 daltons, or from about 50,000 daltonsto about 2,000,000 daltons, or even greater than 5,000,000 daltons, forexample, from 6,000,000 daltons to about 10,000,000 daltons.

Coating solutions that include at least two surface-activegroup-containing polymers can be made using any of the methods offorming polymer blends known in the art. In one exemplary embodiment, asolution of a polyurethane containing silicone end groups is mixed witha solution of a polyurethane containing fluorine end groups (e.g.,wherein the solutions include the polymer dissolved in a suitablesolvent such as acetone, ethyl alcohol, DMAC, THF, 2-butanone, and thelike). The mixture can then be coated onto to the surface of theelongated conductive body using the coating process described elsewhereherein. The coating can then be cured under high temperature (e.g.,about 50-150° C.), as the elongated conductive body is advanced throughthe drying/curing station.

Some amount of cross-linking agent can also be included in the mixtureto induce cross-linking between polymer molecules. Non-limiting examplesof suitable cross-linking agents include isocyanate, carbodiimide,gluteraldehyde or other aldehydes, epoxy, acrylates, free-radical basedagents, ethylene glycol diglycidyl ether (EGDE), poly(ethylene glycol)diglycidyl ether (PEGDE), or dicumyl peroxide (DCP). In one embodiment,from about 0.1% to about 15% w/w of cross-linking agent is addedrelative to the total dry weights of cross-linking agent and polymersadded when blending the ingredients (in one example, about 1% to about10%). During the curing process, substantially all of the cross-linkingagent is believed to react, leaving substantially no detectableunreacted cross-linking agent in the final film.

Described below are examples of layers that can be coated onto theelongated conductive body to form the membrane system.

Diffusion Resistance Layer

In some embodiments, the membrane system comprises a diffusionresistance layer, which may be disposed more distal to the elongatedcore than the other layers. A molar excess of glucose relative to theamount of oxygen exists in blood, i.e., for every free oxygen moleculein extracellular fluid, there are typically more than 100 glucosemolecules present (see Updike et al., Diabetes Care 5:207-21 (1982)).Accordingly, without a semipermeable membrane situated over the enzymelayer to control the flux of glucose and oxygen, a linear response toglucose levels can sometimes be obtained only up to about 40 mg/dL.However, in a clinical setting, a linear response to glucose levels isdesirable up to at least about 500 mg/dL. The diffusion resistance layerserves to address these issues by controlling the flux of oxygen andother analytes (for example, glucose) to the underlying enzyme layer.

The diffusion resistance layer can include a semipermeable membrane thatcontrols the flux of oxygen and glucose to the underlying enzyme layer,thereby rendering oxygen in non-rate-limiting excess. As a result, theupper limit of linearity of glucose measurement is extended to a muchhigher value than that which is achieved without the diffusionresistance layer. In some embodiments, the diffusion resistance layerexhibits an oxygen-to-glucose permeability ratio of approximately 200:1,but in other embodiments the oxygen-to-glucose permeability ratio can beapproximately 100:1, 125:1, 130:1, 135:1, 150:1, 175:1, 225:1, 250:1,275:1, 300:1, or 500:1. As a result of the high oxygen-to-glucosepermeability ratio, one-dimensional reactant diffusion may providesufficient excess oxygen at all reasonable glucose and oxygenconcentrations found in the subcutaneous matrix (See Rhodes et al.,Anal. Chem., 66:1520-1529 (1994)).

In some embodiments, the diffusion resistance layer is formed of a basepolymer synthesized to include a polyurethane membrane with bothhydrophilic and hydrophobic regions to control the diffusion of glucoseand oxygen to an analyte sensor. A suitable hydrophobic polymercomponent can be a polyurethane or polyether urethane urea. Polyurethaneis a polymer produced by the condensation reaction of a diisocyanate anda difunctional hydroxyl-containing material. A polyurea is a polymerproduced by the condensation reaction of a diisocyanate and adifunctional amine-containing material. Diisocyanates that can be usedinclude aliphatic diisocyanates containing from about 4 to about 8methylene units. Diisocyanates containing cycloaliphatic moieties canalso be useful in the preparation of the polymer and copolymercomponents of the membranes of some embodiments. The material that formsthe basis of the hydrophobic matrix of the diffusion resistance layercan be any of those known in the art that is suitable for use asmembranes in sensor devices and as having sufficient permeability toallow relevant compounds to pass through it, for example, to allow anoxygen molecule to pass through the membrane from the sample underexamination in order to reach the active enzyme or electrochemicalelectrodes. Examples of materials which can be used to makenon-polyurethane type membranes include vinyl polymers, polyethers,polyesters, polyamides, inorganic polymers such as polysiloxanes andpolycarbosiloxanes, natural polymers such as cellulosic and proteinbased materials, and mixtures or combinations thereof.

In some embodiments, the diffusion resistance layer can comprise a blendof a base polymer (e.g., polyurethane) and one or more hydrophilicpolymers (e.g., PVA, PEG, polyacrylamide, acetates, PEO, PEA, PVP, andvariations thereof). It is contemplated that any of a variety ofcombination of polymers may be used to yield a blend with desiredglucose, oxygen, and interference permeability properties. For example,in some embodiments, the diffusion resistance layer can be formed from ablend of a silicone polycarbonate-urethane base polymer and a PVPhydrophilic polymer, but in other embodiments, a blend of apolyurethane, or another base polymer, and one or more hydrophilicpolymers can be used instead. In some of the embodiments involving theuse of PVP, the PVP portion of the polymer blend can comprise from about5% to about 50% by weight of the polymer blend, or from about 15% to20%, and or from about 25% to 40%. It is contemplated that PVP ofvarious molecular weights may be used. For example, in some embodiments,the molecular weight of the PVP used can be from about 25,000 daltons toabout 5,000,000 daltons, or from about 50,000 daltons to about 2,000,000daltons, or even greater than about 5,000,000 daltons, e.g., from6,000,000 daltons to about 10,000,000 daltons.

In certain embodiments, the thickness of the diffusion resistance layercan be from about 0.05 microns or less to about 200 microns or more. Insome of these embodiments, the thickness of the diffusion resistancelayer can be from about 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4,0.45, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 6, 8 microns to about 9, 10, 11,12, 13, 14, 15, 16, 17, 18, 19, 19.5, 20, 30, 40, 50, 60, 70, 75, 80,85, 90, 95, or 100 microns. In some embodiments, the thickness of thediffusion resistance layer is from about 2, 2.5 or 3 microns to about3.5, 4, 4.5, or 5 microns in the case of a transcutaneously implantedsensor or from about 20 or 25 microns to about 40 or 50 microns in thecase of a wholly implanted sensor.

The description herein of the diffusion resistance layer is not intendedto be applicable only to the diffusion resistance layer; rather thedescription can also be applicable to any other layer of the membranesystem, such as the enzyme layer, electrode layer, or interferencelayer, for example.

Enzyme Layer

In some embodiments, the membrane system comprises an enzyme layer,which may be disposed more proximal to the elongated core than thediffusion resistance layer. The enzyme layer comprises a catalystconfigured to react with an analyte. In one embodiment, the enzyme layeris an immobilized enzyme layer including glucose oxidase. In otherembodiments, the enzyme layer can be impregnated with other oxidases,for example, alcohol dehydrogenase, galactose oxidase, cholesteroloxidase, amino acid oxidase, alcohol oxidase, lactate oxidase, oruricase. For example, for an enzyme-based electrochemical glucose sensorto perform well, the sensor's response should neither be limited byenzyme activity nor cofactor concentration.

In some embodiments, the catalyst (enzyme) can be impregnated orotherwise immobilized into the diffusion resistance layer such that aseparate enzyme layer is not required (e.g., wherein a unitary layer isprovided including the functionality of the diffusion resistance layerand enzyme layer). In some embodiments, the enzyme layer is formed froma polyurethane, for example, aqueous dispersions of colloidalpolyurethane polymers including the enzyme.

In some embodiments, the thickness of the enzyme layer can be from about0.01, 0.05, 0.6, 0.7, or 0.8 microns to about 1, 1.2, 1.4, 1.5, 1.6,1.8, 2, 2.1, 2.2, 2.5, 3, 4, 5, 10, 20, 30 40, 50, 60, 70, 80, 90, or100 microns. In some embodiments, the thickness of the enzyme layer isfrom about 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 1,1.5, 2, 2.5, 3, 4, or 5 microns to about 6, 7, 8, 9, 10, 11, 12, 13, 14,15, 16, 17, 18, 19, 19.5, 20, 25, or 30 microns, or from about 2, 2.5,or 3 microns to about 3.5, 4, 4.5, or 5 microns in the case of atranscutaneously implanted sensor or from about 6, 7, or 8 microns toabout 9, 10, 11, or 12 microns in the case of a wholly implanted sensor.

It should be understood that the description herein of the enzyme layeris not intended to be applicable only to the enzyme layer; rather thedescription can also be applicable to any other layer of the membranesystem, such as the diffusion resistance layer, electrode layer, orinterference layer, for example.

Electrode Layer

In some embodiments, the membrane system comprises an electrode layer,which may be disposed more proximal to the elongated core than any otherlayer. The electrode layer is configured to facilitate electrochemicalreaction on the electroactive surface and can include a semipermeablecoating for maintaining hydrophilicity at the electrochemically reactivesurfaces of the sensor interface. In other embodiments, thefunctionality of the electrode layer can be incorporated into thediffusion resistance layer, so as to provide a unitary layer thatincludes the functionality of the diffusion resistance layer, enzymelayer, and/or electrode layer.

The electrode layer can enhance the stability of an adjacent layer byprotecting and supporting the material that makes up the adjacent layer.The electrode layer may also assist in stabilizing the operation of thedevice by overcoming electrode start-up problems and drifting problemscaused by inadequate electrolyte. The buffered electrolyte solutioncontained in the electrode layer may also protect against pH-mediateddamage that can result from the formation of a large pH gradient betweenthe substantially hydrophobic interference layer and the electrodes dueto the electrochemical activity of the electrodes.

In one embodiment, the electrode domain includes hydrophilic polymerfilm (e.g., a flexible, water-swellable, hydrogel) having a “dry film”thickness of from about 0.05 microns or less to about 20 microns ormore, or from about 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45,0.5, 1, 1.5, 2, 2.5, 3, or 3.5 microns to about 4, 5, 6, 7, 8, 9, 10,11, 12, 13, 14, 15, 16, 17, 18, 19, or 19.5 microns, or even from about3, 2.5, 2, or 1 microns, or less, to about 3.5, 4, 4.5, or 5 microns ormore. “Dry film” thickness refers to the thickness of a cured film castfrom a coating formulation by standard coating techniques.

In certain embodiments, the electrode layer can be formed of a curablemixture of a urethane polymer and a hydrophilic polymer. In some ofthese embodiments, coatings are formed of a polyurethane polymer havinganionic carboxylate functional groups and non-ionic hydrophilicpolyether segments, wherein the polyurethane polymer undergoesaggregation with a water-soluble carbodiimide (e.g.,1-ethyl-3-(3-dimethylaminopropyl)carbodiimide (EDC)) in the presence ofpolyvinylpyrrolidone and cured at a moderate temperature of about 50° C.

Particularly suitable for this purpose are aqueous dispersions offully-reacted colloidal polyurethane polymers having cross-linkablecarboxyl functionality (e.g., BAYBOND®; Mobay Corporation). Thesepolymers are supplied in dispersion grades having apolycarbonate-polyurethane backbone containing carboxylate groupsidentified as XW-121 and XW-123; and a polyester-polyurethane backbonecontaining carboxylate groups, identified as XW-110-2. In someembodiments, BAYBOND® 123, an aqueous anionic dispersion of an aliphaticpolycarbonate urethane polymer sold as a 35 weight percent solution inwater and co-solvent N-methyl-2-pyrrolidone, can be used.

In some embodiments, the electrode layer is formed from a hydrophilicpolymer that renders the electrode layer substantially more hydrophilicthan an overlying layer (e.g., interference layer, enzyme layer). Suchhydrophilic polymers can include, a polyamide, a polylactone, apolyimide, a polylactam, a functionalized polyamide, a functionalizedpolylactone, a functionalized polyimide, a functionalized polylactam orcombinations thereof, for example.

In some embodiments, the electrode layer is formed primarily from ahydrophilic polymer, and in some of these embodiments, the electrodelayer is formed substantially from PVP. PVP is a hydrophilicwater-soluble polymer and is available commercially in a range ofviscosity grades and average molecular weights ranging from about 18,000to about 500,000, under the PVP homopolymer series by BASF Wyandotte andby GAF Corporation. In certain embodiments, a PVP homopolymer having anaverage molecular weight of about 360,000 identified as PVP-K90 (BASFWyandotte) can be used to form the electrode layer. Also suitable arehydrophilic, film-forming copolymers of N-vinylpyrrolidone, such as acopolymer of N-vinylpyrrolidone and vinyl acetate, a copolymer ofN-vinylpyrrolidone, ethylmethacrylate and methacrylic acid monomers, andthe like.

In certain embodiments, the electrode layer is formed entirely from ahydrophilic polymer. Useful hydrophilic polymers contemplated include,but are not limited to, poly-N-vinylpyrrolidone,poly-N-vinyl-2-piperidone, poly-N-vinyl-2-caprolactam,poly-N-vinyl-3-methyl-2-caprolactam, poly-N-vinyl-3-methyl-2-piperidone,poly-N-vinyl-4-methyl-2-piperidone, poly-N-vinyl-4-methyl-2-caprolactam,poly-N-vinyl-3-ethyl-2-pyrrolidone,poly-N-vinyl-4,5-dimethyl-2-pyrrolidone, polyvinylimidazole,poly-N,N-dimethylacrylamide, polyvinyl alcohol, polyacrylic acid,polyethylene oxide, poly-2-ethyl-oxazoline, copolymers thereof andmixtures thereof. A blend of two or more hydrophilic polymers can beused in some embodiments.

It is contemplated that in certain embodiments, the hydrophilic polymerused may not be crosslinked, but in other embodiments, crosslinking maybe used and achieved by any of a variety of methods, for example, byadding a crosslinking agent. In some embodiments, a polyurethane polymercan be crosslinked in the presence of PVP by preparing a premix of thepolymers and adding a cross-linking agent just prior to the productionof the membrane. Suitable cross-linking agents contemplated include, butare not limited to, carbodiimides (e.g.,1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, UCARLNK®.XL-25 (Union Carbide)), epoxides and melamine/formaldehyde resins.Alternatively, it is also contemplated that crosslinking can be achievedby irradiation at a wavelength sufficient to promote crosslinkingbetween the hydrophilic polymer molecules, which is believed to create amore tortuous diffusion path through the layer.

The flexibility and hardness of the coating can be varied as desired byvarying the dry weight solids of the components in the coatingformulation. The term “dry weight solids” as used herein is a broadterm, and is to be given its ordinary and customary meaning to a personof ordinary skill in the art (and is not to be limited to a special orcustomized meaning), and refers without limitation to the dry weightpercent based on the total coating composition after the time thecrosslinker is included. In one embodiment, a coating formulation cancontain from about 6 to about 20 dry weight percent, or about 8 dryweight percent, PVP; from about 3 to about 10 dry weight percent, orabout 5 dry weight percent cross-linking agent; and from about 70 toabout 91 weight percent, or about 87 weight percent of a polyurethanepolymer, such as a polycarbonate-polyurethane polymer, for example. Thereaction product of such a coating formulation is referred to herein asa water-swellable cross-linked matrix of polyurethane and PVP.

In some embodiments, underlying the electrode layer is an electrolytephase that when hydrated is a free-fluid phase including a solutioncontaining at least one compound, typically a soluble chloride salt,which conducts electric current. In one embodiment wherein the membranesystem is used with a glucose sensor such as is described herein, theelectrolyte phase flows over the electrodes and is in contact with theelectrode layer. It is contemplated that certain embodiments can use anysuitable electrolyte solution, including standard, commerciallyavailable solutions. Generally, the electrolyte phase can have the sameosmotic pressure or a lower osmotic pressure than the sample beinganalyzed. In some embodiments, the electrolyte phase comprises normalsaline.

It should be understood that the description herein of the electrodelayer is not intended to be applicable only to the electrode layer;rather the description can also be applicable to any other layer of themembrane system, such as the diffusion resistance layer, enzyme layer,or interference layer, for example.

Interference Layer

In some embodiments, the membrane system may comprise an interferencelayer configured to substantially reduce the permeation of one or moreinterferents into the electrochemically reactive surfaces. Theinterference layer may be configured to be substantially less permeableto one or more of the interferents than to the measured species. It isalso contemplated that in some embodiments, where interferent blockingmay be provided by the diffusion resistance layer (e.g., via asurface-active group-containing polymer of the diffusion resistancelayer), a separate interference layer may not be used.

In some embodiments, the interference layer is formed from asilicone-containing polymer, such as a polyurethane containing silicone,or a silicone polymer. While not wishing to be bound by theory, it isbelieved that, in order for an enzyme-based glucose sensor to functionproperly, glucose would not have to permeate the interference layer,where the interference layer is located more proximal to theelectroactive surfaces than the enzyme layer. Accordingly, in someembodiments, a silicone-containing interference layer, comprising agreater percentage of silicone by weight than the diffusion resistancelayer, can be used without substantially affecting glucose concentrationmeasurements. For example, in some embodiments, the silicone-containinginterference layer can comprise a polymer with a high percentage ofsilicone (e.g., from about 25%, 30%, 35%, 40%, 45%, or 50% to about 60%,70%, 80%, 90% or 95%).

In one embodiment, the interference layer can include ionic componentsincorporated into a polymeric matrix to reduce the permeability of theinterference layer to ionic interferents having the same charge as theionic components. In another embodiment, the interference layer caninclude a catalyst (for example, peroxidase) for catalyzing a reactionthat removes interferents.

In certain embodiments, the interference layer can include a thinmembrane that is designed to limit diffusion of certain species, forexample, those greater than 34 kD in molecular weight. In theseembodiments, the interference layer permits certain substances (forexample, hydrogen peroxide) that are to be measured by the electrodes topass through, and prevents passage of other substances, such aspotentially interfering substances. In one embodiment, the interferencelayer is constructed of polyurethane. In an alternative embodiment, theinterference layer comprises a high oxygen soluble polymer, such assilicone.

In some embodiments, the interference layer is formed from one or morecellulosic derivatives. In general, cellulosic derivatives can includepolymers such as cellulose acetate, cellulose acetate butyrate,2-hydroxyethyl cellulose, cellulose acetate phthalate, cellulose acetatepropionate, cellulose acetate trimellitate, or blends and combinationsthereof.

In some alternative embodiments, other polymer types that can beutilized as a base material for the interference layer includepolyurethanes, polymers having pendant ionic groups, and polymers havingcontrolled pore size, for example. In one such alternative embodiment,the interference layer includes a thin, hydrophobic membrane that isnon-swellable and restricts diffusion of low molecular weight species.The interference layer is permeable to relatively low molecular weightsubstances, such as hydrogen peroxide, but restricts the passage ofhigher molecular weight substances, including glucose and ascorbic acid.

It is contemplated that in some embodiments, the thickness of theinterference layer can be from about 0.01 microns or less to about 20microns or more. In some of these embodiments, the thickness of theinterference layer can be from about 0.01, 0.05, 0.1, 0.15, 0.2, 0.25,0.3, 0.35, 0.4, 0.45, 0.5, 1, 1.5, 2, 2.5, 3, or 3.5 microns to about 4,5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or 19.5 microns.In some of these embodiments, the thickness of the interference layercan be from about 0.2, 0.4, 0.5, or 0.6, microns to about 0.8, 0.9, 1,1.5, 2, 3, or 4 microns.

It should be understood that the description herein of the interferencelayer is not intended to be applicable only to the interference layer;rather the description can also be applicable to any other layer of themembrane system, such as the diffusion resistance layer, enzyme layer,or electrode layer, for example.

Therapeutic Agents

A variety of therapeutic (bioactive) agents can be used with the analytesensor system. In some embodiments, the therapeutic agent is ananticoagulant for preventing coagulation within or on the sensor. Insome embodiments, the therapeutic agent is an antimicrobial, such as butnot limited to an antibiotic or antifungal compound. In someembodiments, the therapeutic agent is an antiseptic and/or disinfectant.Therapeutic agents can be used alone or in combination of two or moreagents. The therapeutic agents can be dispersed throughout the materialof the sensor. In some embodiments, the membrane system can include atherapeutic agent that is incorporated into a portion of the membranesystem, or which is incorporated into the device and adapted to diffusethrough the membrane.

There are a variety of systems and methods by which the therapeuticagent can be incorporated into the membrane system. In some embodiments,the therapeutic agent is incorporated at the time of manufacture of themembrane system. For example, the therapeutic agent can be blended priorto curing the membrane system. In other embodiments, the therapeuticagent is incorporated subsequent to membrane system manufacture, forexample, by coating, imbibing, solvent-casting, or sorption of thebioactive agent into the membrane system. Although the therapeutic agentcan be incorporated into the membrane system, in some embodiments thetherapeutic agent can be administered concurrently with, prior to, orafter insertion of the device intravascularly, for example, by oraladministration, or locally, for example, by subcutaneous injection nearthe implantation site. In some embodiments, a combination of therapeuticagent incorporated in the membrane system and therapeutic agentadministration locally and/or systemically can be used.

To the extent publications and patents or patent applicationsincorporated by reference herein contradict the disclosure contained inthe specification, the specification is intended to supersede and/ortake precedence over any such contradictory material.

Terms and phrases used in this document, and variations thereof, unlessotherwise expressly stated, should be construed as open ended as opposedto limiting. As examples of the foregoing, the term “including” shouldbe read to mean “including, without limitation” or the like; the term“comprising” as used herein is synonymous with “including”,“containing”, or “characterized by”, and is inclusive or open-ended anddoes not exclude additional, unrecited elements or method steps; theterm “example” is used to provide exemplary instances of the item indiscussion, not an exhaustive or limiting list thereof; adjectives suchas “known”, “conventional”, “normal”, “standard”, and terms of similarmeaning should not be construed as limiting the item described to agiven time period or to an item available as of a given time, butinstead should be read to encompass known, normal, or standardtechnologies that may be available or known now or at any time in thefuture; and use of terms like “preferred”, “desired”, or “desirable”,and terms of similar meaning should not be understood as implying thatcertain features are critical, essential, or even important to thestructure or function of the invention, but instead as merely intendedto highlight alternative or additional features that may or may not beutilized in a particular embodiment of the invention. Likewise, a groupof items linked with the conjunction “and” should not be read asrequiring that each and every one of those items be present in thegrouping, but rather should be read as “and/or” unless expressly statedotherwise. Similarly, a group of items linked with the conjunction “or”should not be read as requiring mutual exclusivity among that group, butrather should be read as “and/or” unless expressly stated otherwise. Inaddition, as used in this application, the articles “a” and “an” shouldbe construed as referring to one or more than one (i.e., to at leastone) of the grammatical objects of the article. By way of example, “anelement” means one element or more than one element.

The presence in some instances of broadening words and phrases such as“one or more”, “at least”, “but not limited to”, or other like phrasesshould not be read to mean that the narrower case is intended orrequired in instances where such broadening phrases may be absent.

All numbers expressing quantities of ingredients, reaction conditions,and so forth used in the specification are to be understood as beingmodified in all instances by the term “about.” Accordingly, unlessindicated to the contrary, the numerical parameters set forth herein areapproximations that may vary depending upon the desired propertiessought to be obtained. At the very least, and not as an attempt to limitthe application of the doctrine of equivalents to the scope of anyclaims in any application claiming priority to the present application,each numerical parameter should be construed in light of the number ofsignificant digits and ordinary rounding approaches.

Furthermore, although the foregoing has been described in some detail byway of illustrations and examples for purposes of clarity andunderstanding, it is apparent to those skilled in the art that certainchanges and modifications may be practiced. Therefore, the descriptionand examples should not be construed as limiting the scope of theinvention to the specific embodiments and examples described herein, butrather to also cover all modification and alternatives coming with thetrue scope and spirit of the invention.

1. A method for manufacturing a continuous analyte sensor, the methodcomprising: applying a conductive material to an elongated conductivebody by advancing the elongated conductive body through a liquidcomprising the conductive material; drying or curing the applied liquidto form a coating of the conductive material on the elongated conductivebody, the coating comprising a portion of the continuous analyte sensor;determining whether a thickness of the coating is within a predeterminedrange; and, if the thickness is below the predetermined range, repeatingsteps of applying a conductive material and drying or curing the appliedliquid until the thickness of the coating is determined to be within thepredetermined range, whereby a continuous analyte sensor configured forin vivo use is obtained.
 2. The method of claim 1, further comprisingremoving a fraction of the conductive material applied to the elongatedconductive body.
 3. The method of claim 1, wherein removing is performedby advancing the elongated conductive body through a die.
 4. The methodof claim 1, wherein the conductive material is Ag/AgCl.
 5. The method ofclaim 1, wherein the predetermined range of the thickness of the coatingis from about 1 micron to about 20 microns.
 6. The method of claim 1,wherein the conductive material is platinum.
 7. The method of claim 1,wherein the predetermined range is from about 1 micron to about 10microns.
 8. The method of claim 1, further comprising applying anadhesion promoter to the elongated conductive body before applying theconductive material.
 9. The method of claim 1, further comprisingetching a portion of the coating.
 10. The method of claim 1, furthercomprising cutting the elongated conductive body into a plurality ofsections.
 11. The method claim 1, wherein each section is associatedwith an individual continuous analyte sensor.
 12. The method of claim 1,wherein the conductive material is Ag/AgCl.
 13. The method of claim 1,wherein the conductive material has a particle size associated with amaximum particle dimension that is less than about 100 microns.
 14. Themethod of claim 1, wherein the elongated conductive body is a wire witha circular cross-sectional shape or a substantially circularcross-sectional shape.
 15. The method of claim 1, wherein the elongatedconductive body comprises an outer surface comprising an insulatingmaterial selected from the group consisting of polyurethane,polyethylene, and polyimide.
 16. The method of claim 1, wherein applyinga conductive material is performed by a reel-to-reel system.